Rohm Co., Ltd.

Yoshihisa Tsukamoto

Masashi Hayashiguchi

Soichiro Takahashi

Masaaki Matsuo

Akihiro Kimura

Kenji Hayashi

Akihiro Suzaki

Tan Nhat Hoang

Provided are switching elements, gate driver ICscontrolling the switching elements, and substratecarrying the gate driver ICs. Substrateincludes baseand conductive portionwith obverse and reverse surface conductive layers. Obverse surface conductive layerincludes first connection portionconnected to control signal output terminalof gate driver IC, second connection portionconnected to gate electrodeof switching element, and first wiring portioninterposed between first and second connection portions. At least one obverse surface-side first electronic componentis provided on obverse surface of substrate, forming a circuit portion connecting first and second connection portionstogether with first wiring portion. No conductive member penetrating through basein the thickness direction is connected to first wiring portion. These configurations increase the speed of drive control.

Power conversion device

Semiconductor device Aincludes: semiconductor elementturning on and off connection between drain electrodeand source electrode; semiconductor elementturning on and off connection between drain electrodeand source electrode; metal componentwith semiconductor elementmounted; metal componentwith semiconductor elementmounted; and conductive substrateincluding wiring layerswith insulating layerbetween them. Wiring layerincludes power terminal sectionconnected to drain electrode. Wiring layerincludes power terminal sectionconnected to source electrode. Power terminal sectionsand insulating layeroverlap with each other as viewed in z direction. Conductive substratesurrounds semiconductor elementsas viewed in z direction, while overlapping with a portion between metal componentsas viewed in z direction.

Semiconductor device

Semiconductor module

The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers. The electroconductive coupling members are connected to the first and second mounting layers. The switching elements are mounted on the first and second mounting layers. Each of the electroconductive coupling members has strip sections and a connecting section. The strip sections extend in the first direction and are spaced in a second direction crossing the thickness direction and the first direction. The connecting section extends in the second direction to interconnect the strip sections. The strip sections are connected at one end to the first mounting layer and connected at another end to the second mounting layer.

A first power supply terminal P is provided with an internal wiring connection portionA, an upright portionB which is joined to the internal wiring connection portionA, an inclined portionC which is joined to the upright portionB and an external wiring connection portionD which is joined to the inclined portionC. A second power supply terminal N is provided with an internal wiring connection portionA, an upright portionB which is joined to the internal wiring connection portionA, an inclined portionC which is joined to the upright portionB and an external wiring connection portionD which is joined to the inclined portionC. The upright portionB of the first power supply terminal P and the upright portionB of the second power supply terminal N are arranged so as to face each other, with a predetermined interval kept therebetween.

Growing community of inventors

Kyoto, Japan

Yoshihisa Tsukamoto