Seiko Instruments Inc

Yoshihisa Tange

Atsushi Sakurai

Kiyoshi Yoshikawa

Kazuaki Sano

Toshiyuki Koike

Takakazu Ozawa

Tsutomu Ando

The invention provides a method and an apparatus for manufacturing a glass-sealed package, whereby anodic bonding of a pair of wafers is ensured over substantially the whole area of the wafers, and whereby a vacuum is ensured inside the cavity during the anodic bonding of the wafers. The invention also provides an oscillator having such characteristics. The manufacturing method of a glass-sealed package includes the step of anodically bonding a pair of wafers by applying voltage to positions corresponding to circumferential portions of the wafers stacked in layers, and the step of dividing the pair of anodically bonded wafers into individual pieces. A through hole is formed at a central portion of at least one of the wafers, and the anodic bonding of the wafers is made by applying voltage using a plurality of electrodes disposed at the positions corresponding to the circumferential portions of the wafers.

Method for manufacturing glass-sealed package, apparatus for manufacturing glass-sealed package, and oscillator

The invention provides a manufacturing method of a glass-sealed package, and a glass substrate used for the glass-sealed package, whereby an amount of warp in a glass substrate is reduced to improve processing accuracy in a subsequent step in which the glass substrate is combined (such as by anodic bonding) with another glass substrate provided with a thin film. The front side of the glass substrate includes a region where the cavities used to house electronic devices such as semiconductor IC chips and crystal blanks are not formed. The region devoid of the cavities is provided in the formed of a frame to reduce an amount of warp in the glass substrate.

Manufacturing method of glass-sealed package, and glass substrate

A method of manufacturing packages includes a welding step for welding a base substrate wafer to a rivet member by heating the base substrate wafer while pressing the same by a forming die from both sides in the thickness direction is provided, wherein a rivet member receiving portion which can receive a distal end of a core member is formed in a receiving die of the forming die, and an inner surface of the rivet member receiving portion is formed into a tapered shape widening from the bottom side toward the opening side.

Method of manufacturing packages, package, piezoelectric, vibrator, and oscillator

Provided are a battery protection IC adaptable to any number of batteries connected in series without increasing a breakdown voltage thereof, and a battery device including the battery protection IC mounted thereon. A charge control signal input terminal and a discharge control signal input terminal of one battery protection IC are provided with a clamp circuit (), and hence an output driver () of another battery protection IC connected to those terminals is not applied with a voltage equal to or higher than a breakdown voltage. Accordingly, the breakdown voltage of the battery protection IC is not required to be high.

Battery protection IC and battery device

Provided is a battery state monitoring circuit including a control circuit that applies, to a gate of a signal output transistor provided at a terminal for transmitting an overcharge detection signal, a potential at which the signal output transistor is turned off at a voltage lower than a minimum circuit operating voltage. Accordingly, in a battery device that uses the cascade-connected battery state monitoring circuits, charge is inhibited securely even at a power supply voltage lower than the minimum circuit operating voltage.

Battery state monitoring circuit and battery device

Provided is a battery state monitoring circuit which is capable of preventing a discharge leak current from a battery so as to eliminate a load conventionally imposed on a user, including: a battery state detector circuit that detects a state of the battery based on a voltage of the battery; a transmitting terminal that transmits battery state information indicative of the state of the battery to an outside; a receiving terminal that receives battery state information of another battery from the outside; a transistor that is used for transmitting the battery state information, and has any one of two terminals except for a control terminal connected to the transmitting terminal; and a diode that is connected in a direction opposite to a direction of a parasitic diode disposed between the two terminals of the transistor, the diode being disposed between the transmitting terminal and one terminal of the transistor.

Battery state monitoring circuit and battery apparatus

Provided is a battery protection circuit and a battery device which may be manufactured at lower cost. Before all terminals of a battery protection circuit are each connected to batteries, even when a logical circuit malfunctions by an operation of a parasitic bipolar transistor formed by P-wells due to a connection order in which the batteries are connected, the logical circuit is reset by an operation of a parasitic bipolar transistor formed by the P-wells. For this reason, a charge/discharge path of the batteries is not interrupted due to the connection order. Accordingly, no limitation is placed on the connection order.

Battery protection circuit and battery device

A charge and discharge control circuit which accommodates pulsed charge and pulsed discharge and can control charge and discharge of a secondary battery with safety, and a rechargeable power supply device having the same built therein are provided. The charge and discharge control circuit includes a delay time switching circuit for shortening a delay time of overcharge detection after charge inhibition is canceled. When overcharge is detected after the charge inhibition is canceled, the charge is inhibited in a delay time which is shorter than a normal delay time of the overcharge detection.

Charge and discharge control circuit and rechargeable power supply device

The invention provides a power source circuit which is capable of preventing a current from being caused to flow from a battery charger to a secondary battery in the over-charge detection state. In order to cut off a current from a parasitic diode of a transistor having a gate electrode to which a signal to release the over-current state is inputted from a switching-device-controlling logic circuit, a charge and discharge controlling circuit includes a diode connected between the transistor and a current detecting circuit, thereby preventing a current from being caused to flow from the battery charger to the secondary battery.

Growing community of inventors

Chiba, Japan

Yoshihisa Tange