Matsushita Electric Industrial Co., Ltd.

Yoshihisa Takase

Masaaki Hayama

Eiji Kawamoto

Kazuhiro Miura

Nobuya Matsutani

Akira Hashimoto

Koji Shimoyama

Akihiko Ibata

Toshio Sugawa

Yuji Yagi

Tsuneshi Nakamura

Takashi Fujii

Mitsuaki Uenishi

Naoki Okazaki

An inductive component in which a large enough inductance is obtainable even when the size is made smaller and the profile is made lower and electronic devices using the inductive component are provided. The inductive component includes a coil, a through hole inside the coil, and a multilayer magnetic layer, and the multilayer magnetic layer is disposed on the top and the bottom surfaces of the coil and the inner wall of the through hole.

Inductive components and electronic devices using the same

A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 &#x3bc;m or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer.

Circuit board and its manufacturing method

The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit board to the circuit on the other side thereof. Each via hole is filled with electro-conductive material to connect the circuits on both sides of the laminating double-side circuit board. The pad on a laminating double-side circuit board and the pad on another laminating double-side circuit board are laminated via a sheet of prepreg for interlayer connection so that the respective pads are opposed to each other via the through hole filled with electro-conductive material formed through the sheet of prepreg for interlayer connection. Thereby, the respective pads on the laminating double-side wiring circuit boards are electrically connected with one another. Thus, the present invention can provide a multilayer printed wiring board having shorter production time, excellent reliability, and high yield.

Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same

An electrode of an electronic device includes plural nickel layers adjacent to each other, and an outer nickel layer contains less phosphorus than an inner nickel layer. The electrode has an increased solder joining strength without having a flexural strength decreased.

Electronic device

A method of printing high-quality high-density circuit pattern in a production of a ceramic thick-film printed circuit board. The method comprises forming a resin layer for prevention of sagging on a substrate before printing the circuit pattern. The present invention provides conditions optimizing materials, thickness, surface roughness, printing conditions and firing conditions of the resin layer. According to the manufacturing method of the present invention, a ceramic thick-film printed circuit board densely printed with a satisfactory printed pattern and free of problems such as film exfoliation, deformation of the pattern, pinholes and the like can readily be obtained.

Method of manufacturing ceramic thick-film printed circuit board

The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.

Manufacturing method of wiring board, and conductive paste used therein

A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio having a dual releasing layer structure is used. In this structure, first releasing layer is formed on the surface of intaglio by chemical absorption, and second releasing layer is formed on the first releasing layer by physical adsorption. This structure allows intaglio to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio . As a result, patterns for electronic components can be formed on substrates at an excellent yield.

Method of manufacturing electronic components using intaglio plate having dual releasing layers

Electroless nickel plating and gold plating is performed on an aluminum electrode in order to construct a highly reliable electrode. The steps are: depositing zinc on the aluminum electrode with zincate treatment liquid containing sodium hydroxide and zinc oxide; immersing it in solution which is prepared by dissolving sodium hypophosphite as a reducing agent into de-ionized water, followed by addition of de-ionized water while adjusting for the pH of 9.0 to 12.0 with sodium hydroxide solution, so as to make a total volume of 1000 ml; nickel-plating the aluminum electrode of the semiconductor device by using electroless nickel plating solution of oxidation-reduction reacting type containing sulfur compound as a reaction promoter, under a condition of the pH at 4.0 to 6.8 and a temperature of 80 to 90.degree. C.; electroless gold-plating by substitutional reaction type; and, electroless gold-plating by oxidation-reduction reacting type, so as to form a nickel film containing phosphor and gold plated films on all aluminum electrodes of the semiconductor device. In this way, a nickel plate film of good electrical conductivity and also a gold plate of a thick film on all aluminum electrodes of the semiconductor device are formed, without resulting in corrosion of the passivation film and the aluminum electrodes.

Method of forming electric pad of semiconductor device and method of

In an IC card of the invention, an IC module (3) is adhered to a first concave (9) of a card base (1) by means of an adhesive (7) and a gap (8) is formed between the outside surface of the IC module (3) and the inside surface of the first concave (9), the gap being wider in the inside upper part and narrower in the inside lower part of the first concave (9), so that the IC chip in the IC module (3) and the card base (1) can be protected from damages caused by bending of the the card base (1).

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Higashiosaka, Japan

Yoshihisa Takase