Matsushita Electric Works, Ltd.

Yoshihisa Sugawa

Masahiro Matsumura

Keiko Kashihara

Hiroshi Yamamoto

Eiichiro Saito

Kenji Ogasawara

Atsuhiro Nakamoto

Kenzi Ogasawara

Tatsuo Yonemoto

Yasuo Tohrin

Ken-ichi Shinotani

Kohei Kotera

Joji Sakakibara

Tomoaki Iwami

Yoshinobu Marumoto

Process of impregnating a layer substrate having openings which is substantially defined by opposing two main surfaces with a resin composition in the form of liquid, and the process is characterized in that one of the main surfaces and the resin composition are kept in such a contact condition that the substrate is located on the resin composition. A prepreg and a laminate are also provided which are produced by the use of the substrate which has been prepared by the above process.

Process of impregnating substrate and impregnated substrate

An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.

Addition type imide resin prepolymer, manufacturing method thereof,

Superior polyimide prepolymers particularly suitable for fabrication of multi-layer printed boards are produced by reacting unsaturated bisimides with diamines to consist essentially of 41-55% of unreacted reactants, 39-54% of components having a molecular weight of between 400 and 15,000, and 3.0-6.8% of components having a molecular weight of more than 15,000. The resulting prepolymers enable the preparation of their solution having enough working life for successfully impregnating a given substrate therewith in the preparation of prepregs. The prepregs, prepared from the above prepolymers in such a way as to contain within the resin content thereof 29-35% of unreacted reactants, 51-65% of the components having a molecular weight of between 400 and 15,000, and 5-14% of the components having a molecular weight of more than 15,000, allow the fabrication of laminate products with remarkable dimension stability under a low molding pressure to eliminate the presence of voids in the products, in addition to that the prepregs ensure a high bond strength as well as elongated working life which is responsible for prevention of a blister in the finished laminate and for easy control of the laminate forming process.

Polyimide prepolymer composition from unsaturated bisimide and diamine

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Yokkaichi, Japan

Yoshihisa Sugawa