Alps Electric Co., Ltd.

Yoshihisa Shibuya

Tatsumaro Yamashita

Masashi Nakagawa

Hideki Watanabe

Shoji Kai

Shunji Kuwana

Kazuya Ishikawa

Shozo Takamura

A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.

High-frequency module

A communication module includes a circuit board having electronic components thereon, an insulative molded member encapsulating the electronic components on the circuit board, and an antenna unit on the molded member. The circuit board is electrically connected to the antenna unit through a post terminal. The antenna unit and the molded member define a cavity therebetween.

Communication module

Growing community of inventors

Miyagi-ken, Japan

Yoshihisa Shibuya