Loctite Corporation

Yoshihisa Okamoto

Philip T Klemarczyk

James P Moran, Jr

Susan Lamtroung Levandoski

Veronica Hanlon

Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator which is not a peroxide, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C. Also, fiber resin composites comprising fiber substrates impregnated with the dual-curing resin compositions is disclosed. Also the process for coating fiber substrates with the dual-curing resin compositions is disclosed.

Method of preparing fiber/resin composites

Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C. Also, fiber resin composites comprising fiber substrates impregnated with the dual-curing resin compositions. Also the process for coating fiber substrates with the dual-curing resin compositions is disclosed.

Filament winding compositions for fiber/resin composites

Filament-winding compositions for fiber/resin composites

Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, a cyanate ester component including at least one cyanate ester compound having at least two cyanate functional groups per molecule, at least one organic peroxide, at least one photoinitiator, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 6 months at about ambient temperature. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half-lives at temperatures of from about 50.degree. C. to less than about 104.degree. C. Also, fiber resin composites comprising fiber substrates impregnated with the dual-curing resin compositions. Also the process for coating fiber substrates with the dual-curing resin compositions is disclosed.

Fiber/resin composites and method of preparation

An aromatic vinyl ether of the formula: ##STR1## wherein: R.sup.1, R.sub.2, R.sub.4, R.sub.5, R.sub.6, R.sub.8, R.sub.9, and R.sup.10 are independently selected from hydrogen, halogen, and C.sub.1 -C.sub.8 alkyl radicals;

Aromatic vinyl ether compounds and compositions, and method of making

The invention relates to a tertiary ammonium alkyl carboxylate primer for bonding surface with cyanoacrylate adhesives, and to a method of bonding low surface energy surfaces using such tertiary ammonium alkyl carboxylates. A preferred primer is tridodecylammonium stearate and preferred solvents for the tertiary ammonium alkyl carboxylate are non-aqueous, low surface tension organic solvents.

Two-part composition comprising a cyanoacrylate adhesive and a primer

An aromatic vinyl ether of the formula: ##STR1## wherein: R.sub.1, R.sub.2, R.sub.4, R.sub.5, R.sub.6, R.sub.8, R.sub.9, and R.sub.10 are independently selected from hydrogen, halogen, and C.sub.1 -C.sub.8 alkyl radicals;

The invention relates to a tertiary ammonium alkyl carboxylate primer for bonding surfaces with cyanoacrylate adhesives, and to a method of bonding low surface energy surfaces using such tertiary ammonium alkyl carboxylates. A preferred primer is tridodecylammonium stearate and preferred solvents for the tertiary ammonium alkyl carboxylate are nonaqueous, low surface tension organic solvents.

Growing community of inventors

Avon, CT, United States of America

Yoshihisa Okamoto