Fujifilm Corporation

Fuji Photo Film Company, Limited

Yoshihisa Negishi

Hiroshi Maeda

Kazuhiro Nishida

Shunichi Hosaka

Takayoshi Oyamada

Eiji Watanabe

Masatoshi Yasumatsu

Manjirou Watanabe

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.

Solid-state imaging device and method for manufacturing the same

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low &#x3b1;-ray glass.

In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.

Method for cutting solid-state image pickup device

It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Solid-state imaging device and method of manufacturing said solid-state imaging device

There are provided a semiconductor substrateon which solid-state imaging devices are formed, and a translucent memberprovided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrateto a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate

Solid-state imaging device and method of manufacturing the same

A decurl apparatus includes a heating device to heat an image recording carrier web at a constant temperature, which exceeds the glass transition temperature of a support for a constant time period; and a cooling device for subsequent cooling of the image recording carrier web to a temperature equal to or lower than the glass transition temperature, while the image recording carrier web maintains a predetermined shape. The heating device includes an induction-heated heating roller and holding rollers arranged at arbitrary angular positions with respect to the outer circumference of the heating roller. As a result, the image recording carrier web is reliably decurled by a simple construction without being influenced by a transfer velocity or the like.

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Kanagawa, Japan

Yoshihisa Negishi