Lintec Corporation

Efuesukei Kabushiki Kaisha

Yoshihisa Mineura

Hayato Noguchi

Kazuhiro Takahashi

Takeshi Kondo

Kazuyoshi Ebe

Hideki Numazawa

Hideo Senoo

Katsuhiko Horigome

Toshihiko Sato

Hitoshi Maruhashi

Kazuyosi Ebe

Mitsugu Koike

Masatoshi Matsumoto

Hitoshi Sakashita

Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120&#xb0; C. of 5&#xd7;10Pa or less. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warp and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.

Pressure sensitive adhesive double coated sheet and method of use thereof

A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23&#xb0; C. ranging from 5.0&#xd7;10to 1.0&#xd7;10Pa, the intermediate layer exhibiting an elastic modulus at 23&#xb0; C. which is not greater than the elastic modulus at 23&#xb0; C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40&#xb0; C. of less than 1.0&#xd7;10Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working and to enable performing the grinding at a uniform thickness without the occurrence of dimples.

Pressure sensitive adhesive sheet

The invention is concerned with a pressure sensitive adhesive sheet comprising a substrate and, superimposed thereon, a pressure sensitive adhesive layer, said substrate exhibiting a maximum value of dynamic viscoelasticity tan &dgr; of at least 0.5 at a temperature ranging from &minus;5 to 80&deg; C. At the time of working of the back of an adherend having a surface whose irregular height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working.

Method of using a pressure sensitive adhesive sheet

A method of securing semiconductor chips comprises the steps of: sticking semiconductor chips at their backs to a transfer tape having an adhesive superimposed thereon at spaced intervals; peeling the semiconductor chips from the transfer tape such that the adhesive is transferred onto the backs of the semiconductor chips; and securing the semiconductor chips by way of the adhesive onto a substrate. The method also includes variations such as sticking the transfer tape to a substrate at predetermined sites for securing semiconductor chips and then peeling the base material of the transfer tape to transfer the adhesive to the predetermined sites on the substrate, followed by securing the semiconductor chips thereto.

Method of using a transfer tape

Pressure sensitive adhesive sheet and method of use thereof

Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.

Method of using pressure sensitive adhesive double coated sheet

An adhesive sheet used for semiconductor wafer processing; with the adhesive sheet consisting of a release liner, an adhesive layer and a base film which are laminated in order of description, having a great length and being folded zigzag into equal sections so that one section is superposed exactly upon another.

Adhesive sheet

Process for producing chip and pressure sensitive adhesive sheet for said process

A process for producing a chip, comprising the steps of:

Process for producing chip and pressure sensitive adhesive sheet for

A pressure sensitive adhesive composition is disclosed which comprises an acrylic copolymer (A), an energy beam polymerizable urethane acrylate oligomer (B) and an energy beam polymerizable compound having one acryloyl group or methacryloyl group in each molecule thereof (C). This composition is preferred to further contain a plasticizer (D), a crosslinking agent (E) and/or a photopolymerization initiator (F) according to necessity. The pressure sensitive adhesive composition has satisfactory pressure sensitive adherence and initial adhesion before the irradiation with energy beam and the adhesive strength thereof is sharply reduced with maintaining the rubber elasticity after the irradiation with energy beam. Further, the pressure sensitive adhesive composition ensures excellent chip alignability in the expanding step subsequent to dicing. The pressure sensitive adhesive composition provides a pressure sensitive adhesive sheet, especially, a wafer processing pressure sensitive adhesive sheet or a surface protective pressure sensitive adhesive sheet.

Pressure sensitive adhesive composition and sheet having layer thereof

An adhesive sheet which comprises a support sheet and an adhesive layer containing a migratory substance, disposed on one side of the support sheet. This adhesive sheet may be applied to many types of articles and will leave behind a dye mark on the article indicating that it has been applied and subsequently removed.

Growing community of inventors

Tokyo, Japan

Yoshihisa Mineura