Murata Manufacturing Co., Ltd.

Yoshihisa Masuda

Yoshihito Otsubo

Norio Sakai

Issei Yamamoto

Hideo Nakagoshi

Yuta Morimoto

Ryoichi Kita

Katsuki Nakanishi

Yukio Nakazawa

Yoriyuki Matsumoto

Hiroaki Tsuchida

The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

High-frequency module and manufacturing method therefor

A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

Radio frequency module and method for manufacturing the same

A high-frequency module includes a wiring board; a plurality of components mounted on an upper surface of the wiring board; a sealing resin layer that is stacked on the upper surface of the wiring board and that has a step; a groove that is formed in the sealing resin layer to intersect with the step when the wiring board is viewed in plan view, and that extends between predetermined components; and a shield wall disposed in the groove and formed with a conductor. The groove includes a first portion at an upper surface side of the wiring board and a second portion at an upper surface side of the sealing resin layer, the second portion being continuous from the first portion. An area of the second portion is larger than an area of the second portion.

High-frequency module

Growing community of inventors

Kyoto, Japan

Yoshihisa Masuda