Oji Holdings Corporation

Yoshihisa Hatta

Kei Shinotsuka

Kotaro Dai

Yasuhito Kajita

A mold for manufacturing an optical element is provided with a base material, and a recessing and protruding layer formed on a surface of the base material. The recessing and protruding structure of the recessing and protruding layer having a plurality of areas continuously arranged in a positional relationship in which the central point of seven adjacent protrusions is an intersection point of diagonal lines of six vertices of a regular hexagon, and the areas, shapes, and crystal orientations of the plurality of areas are random.

Mold for manufacturing optical element and production method for same, and optical element

A method of manufacturing a semiconductor light emitting device, including arranging a plurality of particles in a monolayer on a substrate, dry etching the plurality of particles arranged to provide a void between the particles in a condition IN which the particles are etched while the substrate is not substantially etched; and dry etching the substrate using the plurality of particles after the particle etching step as an etching mask, thereby forming an uneven structure on one surface of the substrate.

Dry etching method of manufacturing semiconductor light emitting device substrate

A semiconductor light emitting device substrate including an uneven structure on one surface, the uneven structure including numerous convex portions and a flat surface between the convex portions, and multiple areas in which the central portions of seven adjacent convex portions are continuously and positionally aligned to become six vertices and intersection points of diagonal lines of a regular hexagon, and the area, shape and lattice orientation of the plurality of areas are random. A semiconductor light emitting device including the semiconductor light emitting device substrate; and a semiconductor functional layer laminated on the semiconductor light emitting device substrate.

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Tokyo, Japan

Yoshihisa Hatta