Nitto-denko Corporation

Yoshihiro Toyoda

Terukazu Ihara

Kei Nakamura

Takatoshi Sakakura

Makoto Tsunekawa

Kousuke Murakami

A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

Method of manufacturing printed circuit board and method of inspecting printed circuit board

A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

Method of inspecting printed circuit board, method of manufacturing printed circuit board and inspection device of printed circuit board

An inspection device includes a light emitting unit emitting incident light that enters the insulating cover layer and a light receiving unit receiving reflected light that is reflected from the incident light on the surface of the insulating cover layer. The light emitting unit includes a first light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 25&#xb0; or less and a second light emitting portion in a ring state that emits the incident light so that the angle thereof with respect to the surface of the insulating base layer is in the range of 35 to 65&#xb0;.

Inspection device and producing method of wired circuit board

A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Wired circuit board

A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Method of producing a wired circuit board

A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

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Osaka, Japan

Yoshihiro Toyoda