Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Minolta Company, Ltd.

Yoshihiro Tomita

Koichi Hirano

Kazuo Eda

Tetsuyoshi Ogura

Takashi Ichiryu

Masato Sugimoto

Seiji Karashima

Ryoichi Takayama

Osamu Kawasaki

Akihiko Namba

Susumu Sawada

Masanori Minamio

Koji Nomura

Koji Kawakita

Masanori Nomura

Akihiro Kanaboshi

Seiichi Nakatani

Toshiyuki Fukuda

Tsuguhiro Korenaga

Satoru Fujii

Hideo Torii

Katsumi Imada

Tetsuro Otsuchi

Masayuki Okano

Hiroki Sato

Keiji Onishi

Yutaka Taguchi

Katsu Takeda

Satoru Tomekawa

Yasushi Nakagiri

Kunio Hibino

Kazunari Nishihara

Toshio Fujii

Hirofumi Tajika

Atsushi Komatsu

Hikari Sano

Seiji Fujiwara

Takahiro Nakano

Motoyuki Taji

Eiji Fujii

Hiroaki Fujimoto

Hideyuki Nakanishi

Yoshiharu Yamamoto

Motonobu Yoshikawa

Takeshi Suzuki

Mitsuhiro Kasahara

Hisahito Ogawa

Kenji Iijima

Akio Furusawa

Atsushi Tomozawa

Nobuki Itoh

Noriyuki Yoshikawa

Junko Asayama

Atsushi Abe

Hideki Ohmae

Mikihiro Shimada

Yasuhiro Arai

Yasutake Yaguchi

Hiroyuki Ishida

Ichiro Ueda

Hideki Takehara

Hisanori Ishiguro

Hisashi Umeda

Kenichirou Suetugu

Shinji Itamochi

A flexible substrate includes a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed. Each of the plurality of unit wiring structures includes a central section and a plurality of strips disposed at an outer side of the central section. Each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section. The plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation. The plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner.

Flexible substrate

A flexible substrate includes a plurality of unit wiring structures. Each of the unit wiring structures includes: a central section; and at least four curved strips disposed at an outer side of the central section, each of the curved strips having a first end connected to the central section. The central section includes: an insulation layer; interlayer connection via that passes through the insulation layer; first wiring section connected to the interlayer connection via; and second wiring section electrically connected to the first wiring section by way of the interlayer connection via. The first wiring section, insulation layer and second wiring section are disposed in this order, and two of the at least four curved strips extending in a first direction are connected to the first wiring section, other two of the at least four curved strips extending in a second direction are connected to the second wiring section.

A flexible substrate includes unit wiring structures including first and second unit wiring structures that are mutually adjacent. Each of the unit wiring structures includes a central section and one or more strips. Each of the one or more strips has first and second ends. The first end is connected to the central section. The second end of at least one of the one or more strips of the first unit wiring structure and the second end of at least one of the one or more strips of the second unit wiring structure are mutually connected. The flexible substrate includes a gap between a side surface of the mutually connected strips and a side surface of the central section of the first or the second unit wiring structure, and/or between a side surface of the mutually connected strips and a side surface of another strip.

A tactile sensor includes: a first sheet having at least either flexibility or elasticity; and a second sheet having at least either flexibility or elasticity and having a first surface facing the first sheet and a second surface opposite to the first surface. The second surface includes a plurality of protruding shapes. Each of the plurality of protruding shapes includes an enclosed space inside, the enclosed space being defined by the first surface of the second sheet and the first sheet. At least one first electrode pattern is disposed on the first sheet in the enclosed space of each of the plurality of protruding shapes. At least one second electrode pattern is disposed on the first surface in the enclosed space of each of the plurality of protruding shapes.

Tactile sensor that includes two sheets each having at least either flexibility or elasticity

A flexible touch sensor comprises: a first sheet material that has a first major surface, and that has a cushioning property; a second sheet material that includes a conductive material, and that is disposed on the first major surface of the first sheet material; and a conductive wire that is disposed on the first major surface of the first sheet material, and that is sunk into the first sheet material.

Flexible touch sensor and method of manufacturing the same

A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically connected to the electronic component; and a second insulating layer that seals the electronic component, first insulating layer, and second metal layer, in plan view, a curved wiring portion extending from a central portion made up of at least the electronic component, portions of the first insulating layer and first and second metal layers, the curved wiring portion being made up of at least other portions of the first insulating layer, first and second metal layers, and the curved wiring portion being curved at least partially.

Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer

A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

Flexible substrate including stretchable sheet

A flexible optical substrate allows incident light or optical signals to be propagated or transmitted the flexible optical substrate. The flexible optical substrate includes unitary elastic structures. Each of the unitary elastic structures includes a film-like resin material that has a central portion and one or more strips provided outwardly of the central portion. One end of each of the one or more strips is connected to the central portion. Each of the unitary elastic structures has a clearance. Two adjacent unitary elastic structures are linked by at least part of the strips of the two adjacent unitary elastic structures.

Flexible optical substrate

An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.

Electronic device and manufacturing method for same

An electronic part package comprises a sealing resin layer, an electronic part and a metal plating pattern layer. The sealing resin layer is provided with a principal surface including a first region that has a bellows-like shape having alternate ridges and valleys and a second region that is flat. The electronic part includes an electrode having a principal surface and is covered by the sealing resin layer except the principal surface, which is surrounded by the second region. The metal plating pattern layer is integrally provided on the first and second regions and on the principal surface of the electrode. A portion of the metal plating pattern layer, the portion located on the first region, has a bellows-like shape having alternate ridges and valleys along an outline of the first region.

Electronic part package

A flexible display device includes a wire embedded layer that has flexibility and has a first principal surface, a thick wire embedded in the wire embedded layer so as to be substantially flush with the first principal surface of the wire embedded layer, an extraction lower electrode electrically connected to the thick wire and disposed on the first principal surface of the wire embedded layer, an emitting layer disposed on the extraction lower electrode, and an upper electrode disposed on the emitting layer. The flexible display device is suitable for large-screen devices and offers high productivity.

Display device and method for manufacturing the same

[Means for Solving Problem] A semiconductor chiphaving a plurality of electrode terminalsis held to oppose a circuit boardhaving a plurality of connection terminalswith a given gap provided therebetween, and the semiconductor chipand the circuit boardin this state are dipped in a dipping bathcontaining a melted resinincluding melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminalsof the circuit boardand the electrode terminalsof the semiconductor chip, so as to form connectorsbetween these terminals. Thereafter, the semiconductor chipand the circuit boardare taken out of the dipping bath, and the melted resinhaving permeated into the gap between the semiconductor chipand the circuit boardis cured, so as to complete a flip-chip mounting body.

Flip-chip mounting method and bump formation method

A driver IC which is operated by a power supply system insulated from a control IC is mounted in the vicinity of a switching element on a first conductor pattern. A second conductor pattern connected to a source terminal or an emitter terminal of the switching element is electrically connected to a third conductor pattern on which the driver IC is mounted. A ground terminal of the driver IC is electrically connected to the third conductor pattern, and a drive terminal of the driver IC is electrically connected to a gate terminal or a base terminal of the switching element.

Power semiconductor module

A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.

Semiconductor chip and semiconductor device

A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.

Microphone and method for fabricating the same

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Osaka, Japan

Yoshihiro Tomita