Mitsubishi Chemical Corporation

Mitsubishi Kasei Corporation

Yoshihiro Takada

Mineo Nishi

Koji Nakano

Keisuke Nakano

Tadashi Kusumoto

A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide type photosensitive compound and a solvent, in which the quinonediazide type photosensitive compound contains a quinonediazide sulfonic acid ester of a polycondensate (d) of at least one phenolic compound (a) of the formula (A) with at least one hydroxy aromatic aldehydes (b) of the formula (B) and at least one carbonyl compounds (c) of the formula (C), and the mixing ratio ((b)/(c) mol ratio) of the hydroxy aromatic aldehydes (b)/the carbonyl compounds (c) is from 1/99 to 99/1, and the polycondensate (d) has a weight average molecular weight of from 600 to 2,000 in terms of polystyrene calculation: ##STR1## (wherein R.sup.1 is an alkyl group having a carbon number of from 1 to 4, an alkoxy group having a carbon number of from 1 to 4 or a hydroxyl group, R.sup.2 is an alkyl group having a carbon number of from 1 to 4 or an alkoxy group having a carbon number of from 1 to 4, R.sup.3 and R.sup.4 are respectively a hydrogen atom, an alkyl group having a carbon number of from 1 to 4, an aryl group or an aralkyl group, l is an integer of from 0 to 3, m is an integer of from 0 to 4, n is an integer of from 1 to 5, and the total number of m and n is not more than 5, provided that plural R.sup.1 or R.sup.2 may be respectively the same or different when l or m is an integer of at least 2).

Photosensitive resin composition and method for forming photoresist

A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2,OR.sup.3,COOR.sup.4 or CH.sub.2 COOR.sup.5,wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3,R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 may be the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.1-4 lower alkyl group, an aryl group or an aralkyl group, provided that R.sup.6 and R.sup.7 are not simultaneously hydrogen atoms.

Method for forming a pattern using a photosensitive composition

A photosensitive resin composition comprising an alkali-soluble resin, a quinonediazide-type photosensitive compound and a solvent, as the main components, wherein the alkali-soluble resin is a polycondensation product of 1 at least one phenolic compound of the following formula (A) and 2 (a) formaldehyde and (b) at least one ketone or aldehyde of the following formula (B), and the mixing ratio of the formaldehyde (a) to the ketone or aldehyde (b) is within a range of from 1/99 to 99/1 in terms of the molar ratio of (a)/(b): ##STR1## wherein R.sup.1 is a group of the formula R.sup.2, OR.sup.3, COOR.sup.4 or CH.sub.2 COOR.sup.5 wherein R.sup.2 is a C.sub.1-4 alkyl group, each of R.sup.3, R.sup.4 and R.sup.5 which are independent of one another, is a hydrogen atom or a C.sub.1-4 alkyl group, n is an integer of from 0 to 3, provided that when n is 2 or 3, a plurality of R.sup.1 are the same or different, and each of R.sup.6 and R.sup.7 which are independent of each other, is a hydrogen atom, a C.sub.1-4 lower alkyl group, an aryl group or an aralkyl group, provided that R.sup.6 and R.sup.7 are not simultaneously hydrogen atoms.

Photosensitive resin composition comprising an alkali-soluble resin made

A photoresist composition useful for the preparation of semiconductors and to be irradiated by light with a wavelength of from 330 to 450 nm, which comprises (1) an alkali-soluble resin, (2) a quinone-diazide type photosensitive compound and (3) a solvent, wherein

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Kitakyushu, Japan

Yoshihiro Takada