Alps Electric Co., Ltd.

Alps Alpine Co., Ltd.

Other

Alps Electric Co., Ltd. and Shiro Koayashi

Yoshihiro Taguchi

Yoshinao Taniguchi

Tomoyuki Yamai

Shiro Kobayashi

Yasuyuki Kitamura

Hisashi Komatsu

Hiroshi Uyama

Mitsuo Bito

Tomofumi Oba

Yoshiyuki Asabe

Shunetsu Satou

Takayuki Fujita

Koji Oguma

Yoshimune Suzuki

Yui Abe

Hiroyuki Sugimura

Satoshi Kawamura

Junko Ito

Setsuo Ishibashi

Katsuhisa Osada

Kenichiro Sameshima

Masanori Maruno

Michita Suzuki

Shunetu Sato

Osamu Sakai

Hiroyoshi Minaguchi

Atsushi Nakamura

A flow passage unit has a column for used in a liquid chromatograph and a support body that supports the column. The column has: a porous stationary phase; a porous pressure adjusting part disposed at least at the flow-in end of the stationary phase, a liquid entering the flow-in end, the pressure adjusting part being harder than the stationary phase; and a covering part that covers the stationary phase and pressure adjusting part. The support body has a first plate and a second plate that are mutually joined, the support body forming a column holding part and a liquid flow passage, the column holding part holding the column between the first plate and the second plate, the liquid flow passage communicating with the column holding part. Pressure applied from the first plate and second plate to the pressure adjusting part is higher than pressure applied to the stationary phase.

Flow passage unit

A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.

Conductor and method of manufacturing the same

A flow channel structure includes a substrate including a supply flow channel that guides a measurement target liquid toward inside; a separation element accommodating unit that accommodates a separation element that separates components included in the measurement target liquid; and a detection unit that guides the measurement target liquid passing through the separation element accommodating unit, wherein measuring light for measuring information about the components is to be irradiated onto the measurement target liquid. The detection unit includes a measurement flow channel part that guides the measurement target liquid, an incident part that is provided at an end of the measurement flow channel part and that guides the measuring light toward inside the measurement flow channel part, and an emission part that is provided at the other end of the measurement flow channel part and that derives the measuring light from the measurement flow channel part.

Flow channel structure and measuring device for measurement target liquid

A conductor includes: a transparent conductive film which is formed on a transparent substrate and includes a silver nanowire; and a metal film of which at least a portion is formed to overlap the transparent conductive film, in which a portion in which the transparent conductive film and the metal film overlap each other includes a buffer film which has adhesion to each of the transparent conductive film and the metal film and does not impede conduction between the transparent conductive film and the metal film. Preferably, the buffer film is, for example, an ITO film, and at this time, an upper surface of the transparent conductive film is a reverse-sputtered surface.

A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cmor more and 10 J/cmor less.

Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method

A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate () of an embodiment is constituted by a first substrate () and a second substrate (), which are bonded to each other through an adhesive layer (), wherein the first substrate () and the second substrate () are formed by a COP or a COC, and the adhesive layer () is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.

Bonded member and process for producing the same

On a surface of a transfer sheet, a resistor paste is first patterned, and a binder resin thereof is then heat-cured to form resistor layers. Next, an electrode paste containing a binder resin, which has a thermosetting temperature lower than a thermosetting temperature and a glass transition temperature of the binder resin of the resistor layers, is patterned on surfaces of the resistor layers and is then heat-cured, thereby forming electrode layers. By the steps described above, powdered silver contained in the electrode layers is unlikely to ooze into the resistor layers.

Resistor substrate with resistor layer and electrode layer and manufacturing method thereof

A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further includes a process for driving the mixed solution: and a process for curing the binder resin by baking. The good solvent is at least one selected from dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, and dipropylene glycol monoethyl ether. The poor solvent is at least one selected from terpineol eat 2-phenoxy ethanol and 2-benzyloxy ethanol.

Resistor and method for producing the resistor

A resistor is provided that is made by laminating at least two resistive layers, where these resistors have conductive particles held in a binder resin. The resistors are laminated such that a top resistor covers a bottom resistor, and a surface of the top resistor is exposed. The resistivity of the top resistor is made smaller than that of the bottom resistor. The top resistor contains carbon fiber and carbon black, where the central particle size of the carbon fiber ranges from 3.5 to 9.0 &mgr;m. The resistor has excellent durability and micro-linearity characteristics. The resistor may also be used as a variable resistor.

Resistor excellent in micro-linearity characteristic and variable resistor using the same

A variable resistor uses a carbon fiber-base resistor with a specific distribution of carbon particle sizes. Because the particle size distribution of carbon fiber is approximately equal to the normal distribution and 80% by volume or more carbon fiber is included in the particle size range from 1 to 20 &mgr;m, high conductivity in the fiber length direction of carbon fiber that is served as structural material for improving the wear resistance does not affect the micro-linearity.

Resistor excellent in micro-linearity characteristic and wear resistance and variable resistor using the same

The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.

Curable resin compound, method for producing the same, and cured-resin

A copolymer of the present invention is produced by copolymerization of an electron-donating monomer having an electron-accepting group and an electron-accepting monomer having an electron-accepting group. The copolymer thus exhibits a high dielectric constant, a low level of hygroscopicity and good adhesion.

Copolymer and method of producing the same

An electroluminescence device comprises a matrix polymer that is a polymer obtained by polymerizing electron-accepting monomers having electron-accepting groups. The electron-accepting groups are cyanoalkyl groups and/or cyanoalkyl-oxyalkyl groups.

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Miyagi-ken, Japan

Yoshihiro Taguchi