Tdk Corporation

Hitachi-high-technologies Corporation

Hitachi High-tech Corporation

Panasonic Corporation

Funai Electric Company Ltd.

National Institute of Information and Communications Technology, Incorporated

Korg Incorporated

Matsushita Electric Industrial Co., Ltd.

Nihon University

Samsung Heavy Industries Co., Ltd.

Yokogawa Hokushin Electric Corp.

Yokogawa Electric Works, Ltd.

Yoshihiro Suzuki

Akihiro Yasui

Kazutoshi Tsuyutani

Masashi Katsumata

Kazuhiro Nakamura

Tetsuya Kawakami

Akihisa Makino

Masashi Akutsu

Hiroyuki Mishima

Hitoshi Tokieda

Toshiyuki Abe

Shuichi Nakagawa

Takamichi Mori

Masayuki Fujise

Yoichi Aruga

Takashi Nakasawa

Hiroshige Ohkawa

Akira Motohashi

Yoshihiro Ogawa

Atsushi Nakamura

Toshio Kimura

Takenori Okusa

Masahiro Ito

Toshihide Orihashi

Yasuhiko Mori

Tsuyoshi Mochizuki

Tadashi Nakajima

Atsushi Ajioka

Yoshiki Muramatsu

Hironori Chiba

Satoru Chida

Mamoru Yamaguchi

Toshihiro Akihisa

Michio Suruga

Tomohide Yokozawa

Masamichi Kawakami

Rie Horiuchi

Osamu Sakuma

Michiru Yokobori

Kazuhiko Miyamoto

Seishiro Mochizuki

Reo Hanada

Hirotaka Kishida

Toshinori Ishikawa

Satoshi Kitajima

Kentaro Matsumoto

Iwao Hamaura

Michitaka Okazaki

Kun Peo Sung

Seong Gi Park

Takuro Aoki

Ki Soo Kim

Hogu Kim

Mitsunobu Hanyu

Yasuo Wako

Shuichi Kurihara

Nobuhisa Kawamura

Tetsuya Yazaki

To improve heat dissipation efficiency in an electronic component embedded substrate for mounting an electronic component of a type being prohibited from connecting to a ground pattern. An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a wiring pattern facing a surface of the heat transfer block, a wiring pattern facing another surface of the heat transfer block, a via conductor connecting the wiring pattern and the surface of the heat transfer block, and another via conductor connecting the wiring pattern and the another surface of the heat transfer block. The surfaces are insulated from each other. Even when an electronic component of a type having large heat generation and being prohibited from connecting to a ground pattern is mounted, the wiring pattern functioning as a heat dissipation pattern is connected to a ground pattern on a motherboard.

Electronic component embedded substrate and circuit module using the same

A sensor package substrate has through holes Vand Vat a position overlapping a sensor chip mounting area. The through hole Vhas a minimum inner diameter at a depth position D, and the through hole Vhas a minimum inner diameter at a depth position Ddifferent from the depth position D. Thus, since the plurality of through holes are formed at a position overlapping the sensor chip mounting area, the diameter of each of the through holes can be reduced. This makes foreign matters unlikely to enter through the through holes, and a reduction in the strength of the substrate is suppressed. In addition, since the depth position Dand depth position Dare located at different depth levels, it is possible to sufficiently maintain the strength of a part of the substrate that is positioned between the through holes Vand V

Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method

Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis deviceis provided with: a reaction diskwhich circumferentially accommodates a plurality of reaction vessels; a specimen dispensing mechanismwhich dispenses a specimen into the reaction vessels; a reagent dispensing mechanismwhich dispenses a reagent into the reaction vessels; a measuring unitwhich measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels; and a cleaning mechanismwhich cleans the reaction vesselsafter measurement. Further, the automated analysis deviceincludes a controllerwhich controls the drive of the reaction disksuch that in one cycle the reaction vesselsmove by an amount A in the circumferential direction in such a way that N and A are mutually prime, B and C are mutually prime, and the relationship A×B=N×C±1 holds, where N is the total number of reaction vesselsaccommodated in the reaction disk, the reaction diskmoves through C (where C>1) rotations+an amount equivalent to one reaction vessel after B (where B>2) cycles, and the number of reaction vesselsmoved in one cycle is A (where N>A>N/B+1).

Automated analysis device

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

Sensor package substrate, sensor module including the same, and electronic component embedded substrate

Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis deviceis provided with: a reaction diskwhich circumferentially accommodates a plurality of reaction vessels; a specimen dispensing mechanismwhich dispenses a specimen into the reaction vessels; a reagent dispensing mechanismwhich dispenses a reagent into the reaction vessels; a measuring unitwhich measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels; and a cleaning mechanismwhich cleans the reaction vesselsafter measurement. Further, the automated analysis deviceincludes a controllerwhich controls the drive of the reaction disksuch that in one cycle the reaction vesselsmove by an amount Ain the circumferential direction in such a way that N and A are mutually prime, B and C are mutually prime, and the relationship A&#xd7;B=N&#xd7;C&#xb1;1 holds, where N is the total number of reaction vesselsaccommodated in the reaction disk, the reaction diskmoves through C (where C&#x3e;1) rotations+an amount equivalent to one reaction vessel after B (where B&#x3e;2) cycles, and the number of reaction vesselsmoved in one cycle is A (where N&#x3e;A&#x3e;N/B+1).

Disclosed herein is a semiconductor IC-embedded substrate that includes insulating layers, conductor layers, and a semiconductor IC embedded in the insulating layers. The insulating layers includes first and second insulating layers. The conductor layers includes a first conductor layer having a first wiring pattern and a second conductor layer having a second wiring pattern. The semiconductor IC includes a rewiring pattern connected in common to power supply pads. The rewiring pattern is connected to the first wiring pattern via a first opening of the first insulating layer. The first wiring pattern is connected to the second wiring pattern via second openings of the second insulating layer. The first opening is greater in area than each of the second openings.

Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing method

Disclosed herein is a circuit board that includes first and second conductor layers, an insulating layer positioned between the first and second conductor layers, and a via conductor formed inside a via penetrating the insulating layer and connecting the first and second conductor layers. The via has a shape in which a diameter thereof is reduced in a depth direction. The via has a first section positioned on the first conductor layer side and a second section positioned on the second conductor layer side. A reduction in the diameter per unit depth in the first section is greater than that in the second section.

Circuit board and its manufacturing method

Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis deviceis provided with: a reaction diskwhich circumferentially accommodates a plurality of reaction vessels; a specimen dispensing mechanismwhich dispenses a specimen into the reaction vessels; a reagent dispensing mechanismwhich dispenses a reagent into the reaction vessels; a measuring unitwhich measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels; and a cleaning mechanismwhich cleans the reaction vesselsafter measurement. Further, the automated analysis deviceincludes a controllerwhich controls the drive of the reaction disksuch that in one cycle the reaction vesselsmove by an amount A in the circumferential direction in such a way that N and A are mutually prime, B and C are mutually prime, and the relationship A&#xd7;B=N&#xd7;C&#xb1;1 holds, where N is the total number of reaction vesselsaccommodated in the reaction disk, the reaction diskmoves through C (where C&#x3e;1) rotations+an amount equivalent to one reaction vessel after B (where B&#x3e;2) cycles, and the number of reaction vesselsmoved in one cycle is A (where N&#x3e;A&#x3e;N/B+1).

The invention provides a highly reliable automatic analyzer and dispenser probe cleaning method that allows for the removal of leftover cleaning water from the outer wall surfaces of a probe without increasing the size of a cleaning bath and contaminating the outer wall surfaces of the probe. A cleaning bath() comprises: a cleaning water outletfor discharging into the cleaning bath() the cleaning water supplied from a cleaning water supply mechanism; and a compressed air outlet, disposed on the trajectory of the cleaning water discharged from the cleaning water outlet, for discharging the compressed air supplied from a compressed air supply mechanismtoward a sample probeor a reagent probeinserted in the cleaning bath().

Automatic analyzer and cleaning method

Disclosed herein is a sensor package substrate that includes a first mounting area for mounting a sensor chip. The sensor package substrate has a through hole formed at a position overlapping the first mounting area in a plan view so as to penetrate the sensor package substrate from one surface to the other surface. The through hole includes a first section having a first diameter and a second section having a second diameter smaller than the first diameter. A step part inside the through hole positioned at a boundary between the first and second sections constitutes a second mounting area for mounting an anti-dust filter.

Sensor package substrate and sensor module having the same

Disclosed herein is a multilayer circuit board that includes a plurality of conductor layers laminated with insulating layers interposed therebetween. The plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers. The first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.

Multilayer circuit board

An automatic analyzer has a transport device which includes a specimen rack gripping mechanism that grips the specimen rack on a first transport path on which the specimen racks are transported by the specimen rack being sandwiched between gripping plates from both sides of flanks in the transport direction to transport the specimen rack along the first transport path and a gripping width controller that controls a distance between the gripping plates of the specimen rack gripping mechanism in accordance with a width of the specimen rack. Accordingly, an automatic analyzer capable of transporting a plurality of types of the specimen racks while suppressing an increase in size of the apparatus and also an increase in cost can be provided.

Automatic analyzer

In a case where a sample containerhas a rubber-made lid, if a sample nozzle descends and comes into contact with the lid, the sample nozzle is relatively moved inside an arm as far as a lid detection distance, and a detector detects a detection plate. A fact that the sample nozzle comes into contact with the lid is stored together with position information of the sample nozzle, into an operation commanding unit. The sample nozzle further continues to descend, and a suction operation of a sample is performed at a predetermined position. In a case where the sample nozzle collides with a frame portion of the lid and external force is applied thereto, the detector detects that the detection plate is relatively moved as far as the detection distance.

Automated analyzer device

Growing community of inventors

Tokyo, Japan

Yoshihiro Suzuki