Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Tokyo Electron Limited

Pannova Semic, LLC

Toyko Electron Limited

Towerjazz Panasonic Semiconductor Co., Ltd.

Yoshihiro Sato

Junji Hirase

Yoshinori Takami

Masashi Murakami

Yoshiyuki Matsunaga

Kazuko Nishimura

Hisashi Ogawa

Toshio Nakanishi

Ryota Sakaida

Tsutomu Oosuka

Ryohei Miyagawa

Yutaka Abe

Yoshiyuki Ohmori

Mitsuyoshi Mori

Satoshi Shibata

Masayuki Takase

Tokuhiko Tamaki

Takayuki Yamada

Takayoshi Yamada

Shigenori Ozaki

Minoru Honda

Seiji Matsuyama

Taiji Noda

Koichi Takatsuki

Hikaru Adachi

Sanshiro Shishido

Yutaka Hirose

Yoshiaki Satou

Yuuko Tomekawa

Hirohisa Ohtsuki

Yutaka Fujino

Hideyuki Arai

Toru Okino

Tatsuo Nishita

Yusuke Sakata

Shota Yamada

Hiroyuki Amikawa

Kosaku Saeki

Yasuyuki Endoh

Shuuichi Ishizuka

Kyosuke Kobinata

Kazuhiko Yamamoto

Yasunori Inoue

Takuya Sugawara

Yoshihiro Hirota

Atsuhiro Kajiya

Tetsuro Takahashi

Takayuki Nishitani

Hiroshi Kobayashi

Makoto Shouho

Yoshinori Osaki

Hideki Doshita

Nobuo Okumura

Tomoe Nakayama

Takeshi Yamashita

Hiroji Shimizu

Susumu Hatano

Manabu Takahashi

Takaaki Fujikawa

An imaging apparatus includes a pixel region including a first substrate section and pixels, and a peripheral region including a second substrate section and no pixels. Each of the pixels includes a first electrode; a second electrode; a photoelectric conversion layer that is disposed between the first electrode and the second electrode; and a charge accumulation region disposed in the first substrate section. The pixel region includes first penetrating electrodes that electrically connect the first electrode to the charge accumulation region. The peripheral region includes second penetrating electrodes. An areal density of the first penetrating electrodes that is a ratio of an area of the first penetrating electrodes to an area of the pixel region is different from an areal density of the second penetrating electrodes that is a ratio of an area of the second penetrating electrodes to an area of the peripheral region.

Imaging apparatus

An imaging device includes a charge accumulator, a first transistor, and a first capacitive element. The first transistor has a first source, a first drain, and a first gate electrode electrically connected to one of the first source and the first drain. The first capacitive element holds the charges and has a first terminal. A fixed potential is supplied to the other of the first source and the first drain. One of the first source and the first drain is always electrically connected to the first terminal of the first capacitive element from start to end of an exposure period.

Imaging device and camera system

An imaging device includes a pixel. The pixel includes a charge accumulator containing an impurity of a first conductivity type, a first transistor, a second transistor, a first well region containing an impurity of a second conductivity type, and a second well region containing an impurity of the first conductivity type. The charge accumulator accumulates charge generated through photoelectric conversion. The first transistor includes a first gate electrode and a first diffusion region containing an impurity of the first conductivity type. The second transistor includes a second gate electrode and a second diffusion region containing an impurity of the second conductivity type. The first transistor and the charge accumulator are located in the first well region, and the second transistor is located in the second well region. A distance between the charge accumulator and the second transistor is larger than a distance between the charge accumulator and the first transistor.

Imaging device

An imaging device includes a semiconductor substrate and a first transistor provided on the semiconductor substrate and including a first gate electrode, a source, and a drain. The semiconductor substrate includes a first well region of a second conductivity type, a second well region of a first conductivity type different from the second conductivity type, a first impurity region of the first conductivity type, the first impurity region being positioned in the first well region, being one of the source and the drain, holding charges generated by photoelectric conversion, and being electrically connected to the first gate electrode, and a second impurity region of the second conductivity type, the second impurity region being positioned in the second well region and electrically connected to the other of the source and the drain.

Imaging device and method for driving the same

An imaging apparatus includes a substrate, a first electrode, a second electrode, a photoelectric conversion layer, a first transistor, and a penetrating electrode. The photoelectric conversion layer is located between the first electrode and the second electrode and converts light into charges. The first transistor includes a first impurity region serving as one of a source and a drain, a second impurity region serving as the other of the source and the drain, and a first gate electrode. The penetrating electrode penetrates the substrate and electrically connects the first electrode to the first impurity region. The charges are accumulated in the first impurity region. A distance between the first impurity region and the penetrating electrode is longer in a plan view than a distance between the second impurity region and the penetrating electrode.

An imaging device includes a semiconductor substrate and pixels, which includes a first pixel and second pixels adjacent thereto. Each of the pixels includes a first photoelectric conversion layer, a first pixel electrode, a first plug that electrically connects the semiconductor substrate and the first pixel electrode, a second photoelectric conversion layer, a second pixel electrode, and a second plug that electrically connects the semiconductor substrate and the second pixel electrode. In the first pixel and the plurality of second pixels, a distance between the closest plugs of the first plugs and the second plugs is larger than or equal to one-half of a pixel pitch, when viewed in a normal direction of the semiconductor substrate.

An imaging device includes a semiconductor substrate and pixels. Each of the pixels includes a first capacitive element including a first electrode provided above the semiconductor substrate, a second electrode provided above the semiconductor substrate, and a dielectric layer located between the first electrode and the second electrode. At least one selected from the group consisting of the first electrode and the second electrode has a first electrical contact point electrically connected to a first electrical element and a second electrical contact point electrically connected to a second electrical element different from the first electrical element. The first capacitive element includes at least one trench portion having a trench shape.

An exemplary imaging device according to the present disclosure includes: an imaging region including a plurality of pixels; a peripheral region located outside of the imaging region; and a blockade region located between the imaging region and the peripheral region. Each of the plurality of pixels includes a photoelectric conversion layer, a pixel electrode to collect a charge generated in the photoelectric conversion layer, and a first doped region electrically connected to the pixel electrode. In the peripheral region, a circuit to drive the plurality of pixels is provided. The blockade region includes a second doped region of a first conductivity type located between the imaging region and the peripheral region and a plurality of first contact plugs connected to the second doped region.

An imaging device includes a semiconductor substrate, a photoelectric converter that converts incident light into a charge, a first impurity region located in the semiconductor substrate, where the first impurity region accumulates the charge and contains impurities of a first conductivity type, a second impurity region located in the semiconductor substrate, where the second impurity region contains impurities of the first conductivity type and is different from the first impurity region, a third impurity region located in the semiconductor substrate, between the first impurity region and the second impurity region in plan view, where the third impurity region contains impurities of a second conductivity type that differs from the first conductivity type, and a first contact located on the semiconductor substrate and electrically connected to the third impurity region. The first contact includes a semiconductor containing impurities of the second conductivity type.

Imaging device comprising isolation region between floating diffusion and another impurity region

An imaging device including a semiconductor substrate; pixels; and a signal line located along the pixels, where each of the pixels includes: a photoelectric converter that generates signal charge by photoelectric conversion, a first transistor that outputs a signal to the signal line according to an amount of the signal charge, and a circuit that is coupled to a gate of the first transistor and that includes a capacitive element, and the signal line is located closer to the semiconductor substrate than the capacitive element.

Imaging device including signal line and unit pixel cell including charge storage region

An imaging device having a semiconductor substrate including: a semiconductor region including an impurity of a first conductivity type, a first diffusion region that is in contact with the semiconductor region, that includes an impurity of a second conductivity type different from the first conductivity type, and that converts incident light into charges, and a second diffusion region that includes an impurity of the second conductivity type and that directly accumulates at least a part of the charges generated in the first diffusion region. The imaging device further includes a contact plug in contact with the second diffusion region, and a capacitive element electrically connected to the second diffusion region through the contact plug.

Imaging device with multiple diffusion regions and capacitor element

An imaging device includes pixels. Each of the pixels includes a first photoelectric conversion layer, a first pixel electrode, a second photoelectric conversion layer, a second pixel electrode, a third photoelectric conversion layer, a third pixel electrode, a first counter electrode, and a second counter electrode. The first pixel electrode, the first photoelectric conversion layer, the first counter electrode, the second photoelectric conversion layer, the second pixel electrode, the second counter electrode, the third photoelectric conversion layer, and the third pixel electrode are arranged in this order.

An imaging device including a semiconductor substrate; a photoelectric converter that converts incident light into a signal charge, the photoelectric converter being stacked on the semiconductor substrate; a node to which the signal charge is input; a transistor having a source and a drain, one of the source and the drain being connected to the node; and a capacitive element connected between the transistor and a voltage source or a ground. The transistor is configured to switch between a first mode and a second mode, a sensitivity in the first mode being different from a sensitivity in the second mode, and in a cross-sectional view, the capacitive element is located between the semiconductor substrate and the photoelectric converter.

Imaging device including a photoelectric converter and a capacitive element having a dielectric film sandwiched between electrodes and a mode switching transistor

An imaging device including: a photoelectric converter that converts light into a charge; a first diffusion region of a first conductivity type to which the charge is input; a second diffusion region of the first conductivity type; a first plug that has a first surface directly connected to the first diffusion region; and a second plug that has a second surface directly connected to the second diffusion region, where an area of the second surface of the second plug is larger than an area of the first surface of the first plug in a plan view.

An imaging device includes: a semiconductor substrate including a first diffusion region of a first conductivity type and a second diffusion region of the first conductivity type; a first plug that is connected to the first diffusion region and that contains a semiconductor; a second plug that is connected to the second diffusion region and that contains a semiconductor; and a photoelectric converter that is electrically connected to the first plug. An area of the second plug is larger than an area of the first plug in a plan view.

Growing community of inventors

Osaka, Japan

Yoshihiro Sato