Oki Electric Industry Co., Ltd.

Oki Semiconductor Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Lapis Semiconductor Co., Ltd.

Aisin Seiki Kabushiki Kaisha

Shinkawa Ltd.

Yoshihiro Saeki

Yasufumi Uchida

Keiichi Uno

Toru Maeda

Osamu Watanabe

Tomonori Nakamura

Hiroyuki Bandai

Manabu Orihashi

Satoru Nagai

Shinji Hiratsuka

Masaki Morita

Keiko Tanaka

Tomoya Yamaguchi

Takayuki Kumamoto

Udara Eshan Manawadu

Satoru Shiga

Kenichi Yanagida

Yuki Miyamoto

Masahide Ishikawa

Atsushi Morita

Miyuki Matsuda

Hiroki Nishimura

Daigo Chabata

Kaname Uzuki

An occupant position detection system includes an imaging device configured to capture an image of an occupant seated on a seat provided in an interior of a vehicle, a sensor provided on the seat, a first calculating unit configured to calculate a first position of the occupant from the image captured by the imaging device, a second calculating unit configured to calculate a second position of the occupant from a detection result of the sensor, an occupant position calculating unit configured to calculate an occupant position by fusing the first position and the second position, and an output unit configured to output information on the occupant position calculated by the occupant position calculating unit, to a safety device.

Occupant position detection system

A temperature environment regulating system includes an in-vehicle temperature conditioner, a thermal sensation estimating section, a preference estimating section, a preference memory section, and a control section. The in-vehicle temperature conditioner regulates passenger-compartment temperature environment in a vehicle. The thermal sensation estimating section estimates thermal sensation, which is an indicator representing how the user senses in-vehicle temperature environment. The preference estimating section estimates temperature preference of the user based on a temporal change in the thermal sensation. The control section controls the in-vehicle temperature conditioner based on the temperature preference memorized by the preference memory section.

Temperature environment regulating system, temperature preference estimating system, and non-transitory computer-readable medium

Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus

A semiconductor device having a first rectangular chip on which wires, electrode pads and chip mounting area are provided, a first dame formed on the first rectangular chip around the electrode pads and the chip mounting area so as to cover the wires and an under fill formed by filling liquid resin between a second rectangular chip mounted on the chip mounting area in a flip-chip manner and the first rectangular chip.

Semiconductor device

Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.

Semiconductor device fabricating method and fabricating apparatus

When there is an extremely low ambient temperature, an electronic control unit controls operation of a circulation path for coolant water in such a manner that, after starting of an engine, the coolant water is supplied from the engine first to a throttle valve and an EGR valve and then to an oil warmer for a transmission. This solves a failure problem in the throttle valve and the EGR valve caused by frost formation at an early stage. As a result, desired operating performance of the vehicle is quickly ensured and heat management in the vehicle is carried out in a desired manner when there is an extremely low ambient temperature.

Vehicle heat management device

The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side surface of the chip, and a plurality of dams formed on the substrate so as to extend along the side surface of the rectangular chip. The configuration allows the semiconductor device to be provided with the substrate having a reduced size which is achieved by preventing a liquid resin from flowing out.

Semiconductor device and plurality of dams

A method of producing a semiconductor device includes: a dicing step of dicing a wafer member using a dicing blade to form a cut portion in the wafer member, in which the wafer member is formed of a wafer portion, a glass substrate, and an adhesive layer for bonding the wafer portion and the glass substrate in a thickness direction of the wafer member so that the cut portion penetrates the wafer portion and the adhesive layer and reaches a part of the glass substrate; and an individual piece dividing step of dividing the wafer member into a plurality of semiconductor devices with the cut portion as a fracture initiation portion.

Method of producing semiconductor device

Semiconductor device and dam for resin

A semiconductor device includes a lower substrate having at least one wiring pattern formed of a plurality of wirings, a semiconductor chip positioned above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chip in columnar form and substantially, and an upper plate which substantially covers a whole upper surface of the intermediate member. A thermal expansion coefficient of the upper plate and a thermal expansion coefficient of the lower substrate are set substantially identical.

Semiconductor device including substrate and upper plate having reduced warpage

A method of manufacturing a semiconductor device is disclosed, which includes at least the steps of preparing a laminated structure including a single chip or a plurality of chips, and dividing the laminated structure into a plurality of sub-laminated structures. A laminated structure comprised of a silicon substrate and a single chip or a plurality of chips laminated on the silicon substrate is formed. Then, the laminated structure is divided into a plurality of sub-laminated structures. Each of the sub-laminated structures includes a semiconductor device.

Semiconductor device and method for manufacturing the same

An acceleration sensor chip package includes an acceleration sensor chip formed of a frame portion with an opening portion, a movable structure, a detection element, and an electrode pad. The movable structure has a beam portion and a movable portion supported on the beam portion to be movable. The acceleration sensor chip package further includes a re-wiring layer with a wiring portion having one end connected to the electrode pad; an outer terminal connected to the other end of the wiring portion; a first sealing portion for sealing the electrode pad and the re-wiring layer; and a substrate for sealing the opening portion of the frame portion.

Acceleration sensor chip package and method of producing the same

To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a main electrode pad group composed of a plurality of main electrode pads, which plurality of main electrode pads is arranged on the main surface along the first side; a first electrode pad group composed of a plurality of first electrode pads, which plurality of first electrode pads is arranged between the first side and the main electrode pad group; a second electrode pad group composed of a plurality of second electrode pads, which plurality of second electrode pads is arranged on the main surface along the second side; a first interconnection connecting the main electrode pad with the first electrode pad; and a second interconnection connecting the main electrode pad with the second electrode pad.

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

A semiconductor device according to the present invention comprises, on a first semiconductor chip, a first circuit element region in which a first electrode group is arranged along an outer periphery of the first semiconductor chip in such a manner as to surround a second semiconductor chip, a second electrode group is arranged along the outer periphery of the first semiconductor chip in such a manner as to surround the first electrode group, and the first semiconductor chip is surrounded by the first electrode group, and a second circuit element region which surrounds the first electrode group and is surrounded by the second electrode group.

Growing community of inventors

Tokyo, Japan

Yoshihiro Saeki