Ebara Corporation

Kyushu Institute of Technology

Other

Yoshihiro Mochizuki

Akira Fukuda

Kazuto Hirokawa

Hirokuni Hiyama

Tetsuji Togawa

Manabu Tsujimura

Tamami Takahashi

Hisanori Matsuo

Kunihiko Sakurai

Yutaka Wada

Yoichi Shiokawa

Ryuji Kodama

Chishiro Yamashina

Shimpei Miyakawa

Keisuke Suzuki

Takahiro Tajiri

Masao Shinoda

Panart Khajornrungruang

Chikako Takatoh

Shiro Kumazawa

Souichirou Ichioka

Shinzo Mammoto

Jpx Mammoto

Tadashi Obo

A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.

Method and apparatus for measuring surface properties of polishing pad

A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed. The polishing apparatus includes a dam configured to dam a liquid on the polishing pad to form a liquid film having a thickness equal to or greater than a prescribed value in at least part of an area on the polishing pad, a light emitter having a light emission end disposed in the liquid film formed by the dam and configured to emit a laser beam onto the polishing pad, a light receiver disposed in the liquid film formed by the dam and configured to receive light scattered by and bounced off the polishing pad at a plurality of angles due to surface properties of the polishing pad after the laser beam is emitted from the light emitter, and a processor configured to perform Fourier transform on the light received by the light receiver into a predetermined wavelength corresponding to a reflection intensity distribution and to determine a feature quantity of the surface properties of the pad.

Polishing apparatus

A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle for supplying a polishing liquid onto the polishing pad, a polishing liquid storage mechanism disposed on the polishing pad for storing the polishing liquid on the polishing pad by damming the polishing liquid, and a polishing liquid sensor for measuring a physical quantity representing the freshness of the polishing liquid stored by the polishing liquid storage mechanism. The polishing apparatus further includes a freshness measuring instrument for calculating the freshness of the stored polishing liquid from the physical quantity measured by the polishing liquid sensor, and a freshness controller for controlling supply conditions of the polishing liquid or storage state of the polishing liquid, based on the freshness of the polishing liquid that is determined by the freshness measuring instrument.

Polishing apparatus and polishing method

A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus

A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad)and the wafer held by a holding member (top ring)and moving the polishing member relative to the wafer. The polishing apparatus includes a top ringfor holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bagfor pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus

A hydraulic drive system that does not cause a decrease in efficiency of actuators, does not hinder an optimal action of devices such as flow adjustment valves, and does not cause any corrosion of water acting as an operating fluid. The system uses water as an operating fluid. The system includes a hydraulic generation apparatusincluding, a main tank, a return path, an accessory tank, and a water disposal apparatusdisposed in a path. The operating fluid from structuring devices of the processing apparatusesandflows through the return path. The operating fluid flows from the accessory tankto the main tankthrough the pathand the water disposal apparatus

Hydraulic drive system

A hydraulic control valve has a valve block provided with a plurality of ports, a valve body formed with ports corresponding to the ports of the valve block, and a plate disposed between the valve block and the valve body. The plate has a flow passage for providing communication between the ports of the valve block and the ports of the valve body. A filter is disposed in the flow passage.

Fluid control valve and plate with filter

An elevation and index apparatus of a water hydraulic driven type has a rotary table ( ) supported pivotally by a cross roller bearing ( ), a water hydraulic motor ( ) and a water hydraulic cylinder ( ), each fixed to a table base ( ) supporting a power transmission mechanism and the cross roller bearing ( ), a main elevation shaft ( ) connected to an output shaft of the water hydraulic cylinder ( ), an elevation and index table ( ) connected to the main elevation shaft ( ) through a bearing ( ) and connected to the rotary table ( ) so as to restrict pivotal movement, and a casing ( ) disposed outside the table base ( ) and enclosing the power transmission mechanism.

Growing community of inventors

Fujisawa, Japan

Yoshihiro Mochizuki