Fujitsu Corporation

Fujitsu Media Devices Limited

Other

Taiyo Yuden Co., Ltd.

Shinko Electric Industries Co., Ltd.

Drnc Holdings, Inc.

Fijitsu Limited

Yoshihiro Mizuno

Osamu Tsuboi

Hisao Okuda

Norinao Kouma

Satoshi Ueda

Ippei Sawaki

Hiromitsu Soneda

Tsuyoshi Matsumoto

Fumio Yamagishi

Xiaoyu Mi

Shin Eguchi

Manabu Ishimoto

Takahiro Matsuda

Masato Nakashima

Takeshi Shioga

Hirokazu Aritake

Takeo Takahashi

Noriko Sato

Yoshitaka Nakamura

Shinichi Hirose

Seiki Sakuyama

Taisuke Iwai

Shigeo Kayashima

Yoshitaka Yamaguchi

Koji Asano

Masaaki Norimatsu

Yukie Sakita

Yohei Yagishita

Yuichi Kamata

Akinori Miyamoto

Jun Taniguchi

Keiichi Omata

A loop heat pipe includes an evaporator configured to vaporize a working fluid, a condenser configured to liquefy the working fluid, a liquid line connecting the evaporator and the condenser, and a vapor line connecting the evaporator and the condenser. The evaporator, the condenser, the liquid line, and the vapor line are formed by stacking a lowermost metallic layer, an uppermost metallic layer, and an intermediate layer set formed of a plurality of metallic layers, which is provided between the uppermost metallic layer and the lowermost metallic layer. The evaporator, the liquid line, the condenser, and the vapor line form a loop-shaped flow path through which the working fluid flows, and a portion of the flow path is formed in the intermediate layer set.

Loop heat pipe

An electronic device includes: a top panel having an operation surface; a position detection circuit configured to detect a position of an operational input performed on the operation surface; a vibrating element mounted to the top panel and configured to generate vibration in the operation surface; and a drive control circuit configured to drive the vibrating element by a drive signal for generating natural vibration in an ultrasonic band in the operation surface, and configured to drive the vibrating element such that intensity of the natural vibration changes according to the position of the operational input on the operation surface and a degree of temporal change of the position.

Electronic device including vibrating element for generating vibration in operation surface of top panel

Disclosed loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.

Loop heat pipe, method of manufacturing the same, and electronic device

There is provided a method of manufacturing a heat radiation sheet, the method including: forming a base film on a substrate; growing a plurality of carbon nanotubes on the base film; and vaporizing at least a part of the base film by heating the base film to coat the carbon nanotube with a coating film containing a material of the vaporized base film.

Heat radiation sheet, method of manufacturing heat radiation sheet, and method of manufacturing electronic device

A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.

Semiconductor device, method of manufacturing the same, and electronic device

An actuator includes a first part having a magnetomotive element and configured to absorb heat up to at least a first temperature; a second part arranged so as to face the first part; a temperature-sensitive magnetic body provided between the first part and the second part and configured to move between a first position for contact with the first part and a second position for contact with the second part, the temperature-sensitive magnetic body having a Curie point lower than the first temperature and higher than a temperature of the second part; and a restoring part configured to restore the temperature-sensitive magnetic body from the first position to the second position.

Actuator, micropump, and electronic equipment

A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source thermally, and a thermoelectric element provided on the heat sink and extending parallel to a direction of extension of the liquid refrigerant flow channel.

Micro channel cooling device, micro channel cooling system, and electronic instrument

A three-dimensional mounting semiconductor device includes a layer structure including a plurality of first substrates with a trench-shaped concavity formed in and a plurality of second substrates with semiconductor elements formed in, which are alternately stacked, wherein an unevenness defined by a size difference between the first substrate and the second substrate is formed on a side surface, and a first through-hole are defined by an inside surface of the trench-shaped concavity and a surface of the second substrate, and a third substrate jointed to the side surface of the layer structure and having an unevenness formed on a surface jointed to the layer structure which are engaged with the unevenness formed on the side surface of the layer structure.

Three-dimensional mounting semiconductor device and method of manufacturing three-dimensional mounting semiconductor device

A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.

Micro movable device and optical switching apparatus

An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Electronic device and method of manufacturing the same

A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Sheet structure, method of manufacturing sheet structure, and electronic device

A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed.

Micromirror unit and method of making the same

An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

Integrated electronic device and method of making the same

A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.

Microstructure and microstructure manufacture method

A micro-structure produced by utilizing a MEMS technology or the like includes: a frame including a portion having a first layer and a portion having a second layer on the lower side of the first layer; a movable body including a portion having the first layer and a portion having the second layer; and at least one swing supporting portion which is having the first layer, and connects the portion having the first layer in the frame and the portion having the first layer in the movable body, to support the movable body to be capable of swinging. A frame side end portion of the swing supporting portion is supported from underneath by the portion having the second layer in the frame, and a movable body side end portion of the swing supporting portion is supported from underneath by the portion having the second layer in the movable body.

Growing community of inventors

Kawasaki, Japan

Yoshihiro Mizuno