Shinko Electric Industries Co., Ltd.

Yoshihiro Machida

Nobuyuki Kurashima

Takaharu Yamano

Tsuyoshi Kobayashi

Hiroyuki Kato

Tetsuya Koyama

Masahiro Sunohara

Kiyoshi Oi

Tadashi Arai

Koichi Tanaka

Takahiko Kiso

Yohei Igarashi

Hiroyuki Saito

An evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface. The porous body includes a first bottomed hole provided in the first inner surface, a second bottomed hole provided in the second inner surface, a first fine pore, wherein the first bottomed hole and the second bottomed hole partially communicate with each other through the first fine pore, a first groove portion provided in the first inner surface and configured to communicate with the first bottomed hole, and a second groove portion provided in the second inner surface and configured to communicate with the second bottomed hole. The first outer surface and the second outer surface serve as an outer surface of the evaporator.

Loop-type heat pipe

A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.

Loop heat pipe

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

At least one of an evaporator, a condenser, a liquid pipe, and a vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer including a porous body. The porous body includes a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, and a first convex portion provided inside the first bottomed hole. The first convex portion has a proximal end connected to a bottom face of the first bottomed hole and a distal end provided on an opposite side to the proximal end in a thickness direction of the first convex portion. The distal end is provided at a position further recessed toward the bottom face of the first bottomed hole than the one face of the inner metal layer.

Loop heat pipe with porous body formed from convex holes

A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a first condenser and a second condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the first condenser and second condenser, a first vapor pipe configured to connect the evaporator and the first condenser; and a second vapor pipe configured to connect the evaporator and the second condenser. The liquid pipe includes a first liquid pipe having a first flow path and connected to the first condenser, a second liquid pipe having a second flow path and connected to the second condenser, and a third liquid pipe having a third flow path connecting to the first flow path and the second flow path and connected to the evaporator.

Loop-type heat pipe including an evaporator, first and second condensers, a liquid pipe connecting the evaporator to the first and second condensers, and first and second vapor pipes connecting the evaporator to the first and second condensers

A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.

Loop type heat pipe

A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to condense the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. Each of the evaporator, the condenser, the liquid pipe and the vapor pipe includes: a pair of outer metal layers; an intermediate metal layer provided between the pair of outer metal layers; and a flow channel defined by the pair of outer metal layers and the intermediate metal layer. At least one of the evaporator, the condenser, the liquid pipe and the vapor pipe further includes a reinforcing member that is built in at least one of the pair of outer metal layers and that is higher in rigidity than the pair of outer metal layers.

Loop heat pipe with reinforcing member

A loop heat pipe includes a pair of outermost metal layers, an intermediate metal layer provided between the pair of outermost metal layers, an evaporator, a condenser, a liquid pipe and a vapor pipe connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, and a porous body provided between the pair of walls. The intermediate metal layer includes a first surface opposing one of the pair of outermost metal layers, and a plurality of first cavities, and a first projection between mutually adjacent first cavities, respectively famed at the first surface between the pair of walls. A first gap is famed between the first projection and the one of the pair of outermost metal layers.

A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.

Loop heat pipe with recessed top or bottom surface

An electronic device includes a light-receiving device configured to receive solar light, a loop-type heat pipe to which heat is input from the light-receiving device and in which an operating fluid is enclosed in a loop-shaped flow path, and a thermoelectric conversion element configured to convert a temperature difference of the loop-type heat pipe into electric power.

Electronic device

A loop heat pipe includes an evaporator to vaporizes a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, and a vapor pipe to connect the evaporator and the condenser, and form a loop-shaped passage together with the liquid pipe. A recess is formed in at least a portion of an outer wall surface of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe.

Loop heat pipe with recessed outer wall surface

A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.

Loop-type heat pipe with vapor moving path in liquid pipe

A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.

Heat pipe with support post

A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser; a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe; and a porous body which is provided in the liquid pipe and configured to reserve liquid-phase working fluid. The liquid pipe includes an injection inlet through which the working fluid is injected. A first end of the porous body is located between the injection inlet and the evaporator. A second end of the porous body which is opposite to the first end is located between the injection inlet and the condenser. At least a portion of the porous body which is provided between the injection inlet and the evaporator fills the inside of the liquid pipe.

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Nagano, Japan

Yoshihiro Machida