Hitachi High-tech Instruments Company, Ltd.

Fasford Technology Co., Ltd.

Yoshihiro Kurihara

Masayuki Mochizuki

Yoshihide Ishii

Shingo Fukasawa

Tatsuyuki Okubo

A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.

Two-shaft drive mechanism and die bonder

The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained. In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit.

Growing community of inventors

Kumagaya, Japan

Yoshihiro Kurihara