Dainippon Screen Mfg. Co., Ltd.

Yoshihiro Koyama

Yasuhiro Mizohata

Takamasa Sakai

Mitsukazu Takahashi

Motohiro Kono

Hideaki Matsubara

Takayuki Umaba

Yoshiyuki Nakagawa

Toshiyuki Kobayashi

A substrate processing apparatus for processing a substrate while transferring the substrate among a plurality of units with which the substrate is to be processed or on which the substrate is to be placed. This apparatus is provided with: a first unit group disposed along a linear first line; a second unit group disposed along a linear second line crossing the first line at a predetermined angle; and a transfer robot capable of transferring and receiving a substrate to and from the first unit group and the second unit group.

Substrate processing apparatus and substrate processing method

A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use; and an undiluted replacement liquid supplying section for supplying an undiluted replacement liquid as a source of the replacement liquid into the buffer container. Copper mesh members each prepared by weaving a copper wire, straight copper pipes or copper plates are accommodated as a copper source in each of the copper dissolution tanks. The copper dissolution tanks each include a detachable cartridge, in which the copper mesh members or the like are disposed.

Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method

In a thermal processing apparatus irradiating a substrate with light from a lamp for heating the substrate, an opening is formed in a reflector for mounting a camera unit. The camera unit images three portions of an auxiliary ring supporting the substrate, for obtaining the position of the center of the auxiliary ring before the thermal processing apparatus receives the substrate therein. The camera unit further images the substrate for obtaining the position of the center of the substrate before the thermal processing apparatus receives the substrate therein and places the same on the auxiliary ring. The thermal processing apparatus moves the substrate so that the center thereof coincides with the center of the auxiliary ring, and thereafter places the former on the latter. Thus, the auxiliary ring can be so designed as to reduce overlaps of the auxiliary ring and the outer edge of the substrate while the overlaps can be rendered uniform over the entire circumference of the substrate for improving temperature uniformity of the substrate.

Thermal processing apparatus

A probing apparatus is used to measure electrical characteristics of a semiconductor device formed on a wafer. The apparatus includes means for holding the wafer in a vertical or slightly leaned position on a frame, a contact needle, three-directional drive means for holding the needle on the frame movably both vertically and horizontally along the device-bearing surface of the wafer and for bringing the needle into releasable contact with a desired portion of the device-bearing surface of the wafer, and a microscope provided in such a way that the tip of the needle is seen substantially at the center of the field of view, said microscope being movable together with the needle along the device-bearing surface of the wafer.

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Kyoto, Japan

Yoshihiro Koyama