Murata Manufacturing Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Yoshihiro Koshido

Koji Fujimoto

Makoto Tose

Masatoshi Nakagawa

Michio Kadota

Takeshi Nakao

Hitoshi Kuromi

Taro Ueno

Emi Matsushita

Takashi Iwamoto

Toshimaro Yoneda

Hajime Yamada

Yuji Toyota

Naoko Aizawa

Yoshiyuki Tonami

Shinji Otani

Masayuki Yoneda

Kenji Sakaguchi

Shigeru Maeda

Toshiyuki Fuyutsume

Atsushi Ishida

Toru Yabe

Tadayuki Okawa

Katsuki Nakanishi

Toshiaki Furuya

Yasuaki Matsumura

Masayuki Hasegawa

Ryoichiro Takahashi

Kei Fujibayashi

A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.

Solid-state electrolytic capacitor manufacturing method and solid-state electrolytic capacitor

A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of the valve-action metallic substrate, and a cathode layer covering a surface of the dielectric oxide film. The laminated body has two principal surfaces and more than one side surface, and has at least one of the side surfaces with the valve-action metallic substrates exposed. An anode terminal is electrically connected to the side surface of the laminated body having the valve-action metallic substrates exposed therefrom, and the cathode layers and the anode terminal are insulated with insulators interposed therebetween, the insulators being obtained from the cathode layers.

Solid electrolytic capacitor and manufacturing method therefor

A solid electrolytic capacitor that includes a laminated body, a solid electrolyte layer, and conductive bases. The laminated body is obtained by laminating a plurality of dielectric-coated valve action metal sheets, each of which includes a valve action metal base and a dielectric coating, and joining together the adjacent valve action metal bases. The valve action metal base has a cathode layer part, and the dielectric coating covers the surface of the valve action metal base at least the cathode layer part. The valve action metal base of at least one of the dielectric-coated valve action metal sheets further has an anode lead part. The solid electrolyte layer is a continuous layer that fills gaps between the dielectric-coated valve action metal sheets and covers the outer surface of the laminated body at the cathode layer parts, and conductive bases are provided in the solid electrolyte layer.

Solid electrolytic capacitor and method for producing the same

An in-liquid-substance detection sensor that achieves size reduction and detection accuracy improvement includes a piezoelectric substrate, at least two SAW devices provided on one major surface of the piezoelectric substrate and each having at least one IDT electrode defining a sensing portion, outer electrodes provided on the other major surface of the piezoelectric substrate and electrically connected to the SAW devices through vias extending through the piezoelectric substrate, a channel-defining member provided on the one major surface of the piezoelectric substrate so as to surround the SAW devices and a region connecting the SAW devices to each other, thereby defining sidewalls of a channel, and a protective member bonded to the one major surface of the piezoelectric substrate with the channel-defining member interposed therebetween, thereby sealing the channel, the protective member having at least two through holes communicating with the channel.

In-liquid-substance detection sensor

An ignition element mounting capacitor having an ignition element mounted on a capacitor, includes therein a first capacitor section and a second capacitor section, and first external terminal electrodes electrically connected to the first capacitor section and second external terminal electrodes electrically connected to the second capacitor section. The first capacitor section has a capacity for igniting ignition powder, and the second capacitor section has a function for removing noise which affects external circuits. Further, provided on the surface of the capacitor are third external terminal electrodes electrically connected to the ignition element. In this manner, the invention provides a squib enabling its size to be miniaturized and its quality to be improved, while keeping a high productivity, and hence provides a header assembly and a ignition element mounting capacitor as components of the squib and further provides a gas generator having such a squib installed therein for an air bag and a gas generator having the squib for a seat belt pretensioner.

Ignition element mounting capacitor, header assembly, squib and gas generator for air bag and gas generator for seat belt pretensioner

A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.

Method of wiring formation and method for manufacturing electronic components

A piezoelectric device includes an element substrate having a piezoelectric element and an electrically conductive pattern connected to the piezoelectric element, a supporting layer arranged within the periphery of the piezoelectric element, a cover extending so as to provide a groove inside the external periphery of the element substrate, the groove ranging over the entire external periphery of the element substrate by removing a portion of the cover and/or supporting layer inside the external periphery of the element substrate after the cover is arranged on the supporting layer, an insulating reinforcing material that entirely covers portions of the element substrate ranging from the cover to the periphery of a principal surface of the element substrate, and an electrically conductive member electrically connected to the electrically conductive pattern so as to pass through the cover and the reinforcing material.

Piezoelectric device

A SAW device includes a SAW element having an IDT and a conductive pad connected to the IDT provided on a piezoelectric substrate, and an external terminal. The SAW device also includes an insulating layer having an exciting portion protective opening defining a space for protecting a SAW-exciting portion including the IDT and a conductive opening. The external terminal is connected to the conductive pad through a wiring extending in the conductive opening.

Piezoelectric component and method for manufacturing the same

A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the bonding substrate such that a protective space of the IDT is provided. The bonding substrate includes a through-hole in which an external terminal connection member connected to the conductive pad and an external terminal are disposed. The SAW is bonded to the bonding substrate by an adhesive layer including a solder layer.

Chip-size package piezoelectric component

A surface acoustic wave device includes a piezoelectric plate and at least one interdigital electrode provided on the piezoelectric plate. The interdigital electrode includes a first metallic thin film and a second metallic thin film laminated on the first metallic thin film and containing tantalum as a principal component, and at least a portion of the tantalum of the second metallic thin film is &agr;-tantalum.

Method for manufacturing a surface acoustic wave device

Methods of forming a resist pattern, of forming an electrode pattern, and of manufacturing a surface acoustic wave device are provided. The resist-pattern- and the electrode-pattern-forming methods each comprise a step of forming an antireflection film for preventing ultraviolet light from diffusely reflecting to a transparent substrate. The antireflection film is formed with a semiconductor having a band gap energy of 3.4 eV or less. The reflectance is expressed by (n &minus;n ) /(n &plus;n ) is 0.15 or less, wherein n and n is the refractive indexes of the substrate and the antireflection film, respectively. The resist-pattern- and the electrode-pattern-forming methods with simple processes can achieve high-quality, reliable resist patterns and electrode patterns.

Methods of forming resist pattern, forming electrode pattern, and manufacturing surface acoustic wave device

A surface acoustic wave device which utilizes excitation of a shear horizontal wave includes a piezoelectric substrate and an interdigital transducer provided on the piezoelectric substrate. The interdigital transducer includes at least three metal layers containing at least one first layer made of a metal with a density of approximately 15 g/cm or more as a major component and at least one second layer made of a metal with a density of about 12 g/cm or less. The volume of the first layer being in the range from about 20% to about 95% of the total volume of the interdigital transducer or the reflector.

Surface acoustic wave device

A method for manufacturing a surface acoustic wave apparatus decreases a specific resistance of an electrode film by removing hydrogen occluded in the electrode film that is primarily composed of tantalum, so that the device properties are stabilized. An electrode film primarily composed of tantalum is formed on a piezoelectric substrate. Subsequently, this electrode film is heat-treated in a vacuum at a temperature of about 200&deg; C. to about 700&deg; C. for several hours. Thereafter, the electrode film is patterned so as to produce an interdigital electrode transducer.

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Kanazawa, Japan

Yoshihiro Koshido