Hitachi, Ltd.

Kokusai Electric Co., Ltd.

Hitachi Plant Technologies, Ltd.

Yoshihiro Kondo

Shigeo Ohashi

Tsuyoshi Nakagawa

Takashi Naganawa

Rintaro Minamitani

Tadakatsu Nakajima

Hitoshi Matsushima

Yuji Yoshitomi

Akio Idei

Makoto Kitano

Noriyuki Ashiwake

Masato Nakanishi

Hiroyuki Toyoda

Shinji Matsushita

Shigeyasu Tsubaki

Susumu Iwai

Tomoo Hayashi

Takeshi Kato

Osamu Suzuki

Tatsuya Saito

Hajime Katou

Yasushi Neho

Naoyuki Sakamoto

Yuuji Yoshitomi

Yoshito Ohmura

Yukiko Iwama

Yasuhiko Sasaki

Hiroshi Kuwahara

Kenji Ogiro

Toshio Hatada

Arata Nakagoshi

Tetsuo Takemura

Mitsuhiro Wada

Yoshinobu Yamamoto

Shinichi Iwaki

Toshihiro Komatsu

Yutaka Fukushima

Yumiko Watanabe

Nariaki Shigyo

Isao Shimbo

Yasunori Yamada

Kouichi Ohta

Hirofumi Udaki

Masao Wanami

Mitsuyoshi Hashida

Yutaka Uematsu

Tatsuo Morita

Satoru Watanabe

Takayuki Ono

Hideki Osaka

Hiroshi Yamada

Masatsugu Arai

Jun Okitsu

Hiroshi Ito

Kenta Kumagai

Hitoshi Ueno

Yuji Shirai

Fumio Takeda

Akiomi Kohno

Satoshi Muraoka

Masabumi Shibata

Takayuki Atarashi

Yuichi Fukuda

Kazunori Nakajima

Michinori Naito

Shigeyuki Sasaki

Yoko Shiga

Takayuki Fujimoto

Kanji Otsuka

Shinichi Shimode

Yasuhiro Kashirajima

Takumi Sugiura

Takashi Miyagawa

Akiyoshi Iida

Hiroshi Kakita

Masaaki Eishima

Kazuo Morita

Yusuke Fukumura

Taishi Sumikura

Shigemasa Satoh

Mitsuru Honma

Hiroshi Tsuzaki

Kenji Onishi

Shouhei Fuse

Tetsuro Homma

Katsunori Nakatani

A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein

The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

Computer provided with cooling system

In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

Operational management method for information processing system and information processing system

A cooling system for cooling a CPUmounted on a printed circuit boardwithin a housing thereof, has a heat-receiving jacket, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenserreceives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Cooling system and electronic apparatus applying the same therein

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Electronic apparatus

A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

Blade server

A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Cooling device and electronic equipment including cooling device

An electronic equipment cooling system of the invention comprises: a heat receiver; a closed refrigerant circulation path (including: the heat receiver; a refrigerant condenser; a refrigerant pump; and a refrigerant tank); and a closed gas circulation path (including: the heat receiver; the refrigerant condenser; and a blower). The heat receiver includes: a heat receiver base contacting a heat generating component; a box; a gas flow space surrounded by the heat receiver base and box; a refrigerant inlet through which a liquid refrigerant dribbles down along an internal surface of the heat receiver base; a liquid refrigerant spreader used for spreading the liquid refrigerant thereacross and having a mesh portion with an opening for passing a vapor of the refrigerant into the gas flow space; a gas inlet through which a gas is fed from the blower; and a gas outlet for venting the gas containing the vapor of the refrigerant.

Electronic equipment cooling system

An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

Electronic device and a thermal connector used therein

It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

Cooling device and electronic apparatus using the same

A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.

Liquid cooling system and electronic apparatus using the same

A liquid crystal panel device, being able to transfer heat generation within each of cells building up a panel, into an outside thereof, effectively, therefore being suitable for use in a liquid crystal projection, etc., comprises: a TFT substrate, which is formed with semiconductor portionsand pattern layersin large numbers on the surface thereof; an opposed substrate; and a liquid crystal layerhermetically enclosed between them, wherein heat interruption layersare formed on a surface of the opposed substrate, in opposite to the liquid crystal layer, at the same positions to those of the semiconductor portions, which are formed on the FTF substrate, and further comprises an anti-dust glass platedisposed at the light-inlet side thereof, so as to define a space, including a gapand grooves, for receiving a cooling liquidtherein, on the opposite side surface of the opposed substrate, in vicinity of the heat interruption layers, thereby achieving cooling, effectively, so as to obtain the liquid crystal panel device being long in the lifetime and high in reliability thereof.

Liquid crystal panel device having a cooling medium within grooves which are formed vertically/horizontally along the heat interruption layer

A liquid cooling system, comprises: heat-receiving jacket, thermally connected with a heat-generation element, a pump attached onto a radiator, and a tank portionon the radiator, wherein a coolant liquid is circulated between the heat-receiving jacketand the radiatorby means of the pump, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

Liquid cooling system

An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Electronic equipment

In order to perform high efficient cooling without boiling cooling liquid and to improve maintainability such as replacement of a lamp, the present invention provides a liquid crystal projector including a light source lamp, a liquid crystal panel, a power source, a fan for removing heat generated by the power source and the lamp, a water-cooling jacket provided on an inner surface of an external wall portion opposed to the lamp in the liquid crystal projector, a metal pipe arrangement for radiation which is placed in the external wall portion, and a pump for driving cooling liquid to flow in the water-cooling jacket so that the cooling liquid receiving the heat from the lamp circulates in a circulation path through the water-cooling jacket, the metal pipe arrangement, and the pump to emit the heat to the outside through the metal pipe arrangement.

Liquid crystal projector

Growing community of inventors

Tsuchiura, Japan

Yoshihiro Kondo