Fuji Electric Co., Ltd.

Yoshihiro Kodaira

Kazunaga Onishi

Yoshikazu Takamiya

Shunsuke Saito

Hirohiko Watanabe

Masayuki Soutome

Shinji Sano

Fumio Shigeta

Takaaki Funakoshi

Kazunaga Oonishi

A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

Solder material

A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.

Member for semiconductor device

Provided is a semiconductor device having: a terminal portion having a through hole is formed on a principal surface portion; and a casing portion in which an opening to make the principal surface portion of the terminal portion exposed is provided, wherein the opening has a corner portion corresponding to a corner of the principal surface portion of the terminal portion, wherein the casing portion has a thick portion, in which thickness of a resin may be greater than that of a middle portion between adjacent corner portions across two sides forming the corner portion, in a surrounding area of the opening. Furthermore, a slit portion extending outward from the corner portion may be formed in the casing portion. At least a part of the outline of the slit portion as viewed from the upper surface direction of the casing portion may be curved.

Semiconductor device

A semiconductor device is provided. The semiconductor device includes a terminal portion and a casing portion. The terminal portion has a through hole in a principal surface portion. The casing portion has a depression at a position facing the through hole and has an end surface facing portion facing an end surface of the terminal portion. An end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.

The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layerhaving a melted solder material, containing Sb at more than 5.0% by mass and 10.0% by mass or less, Ag at 2.0 to 4.0% by mass, Ni at more than 0 and 1.0% by mass or less, and a balance made up of Sn and inevitable impurities; and joining membersandat least one of which is a Cu or Cu-alloy member, in which the solder joining layer includes a first structurecontaining (Cu, Ni)(Sn, Sb)and a second structurecontaining (Ni, Cu)(Sn, Sb)(in the formula, X is 1, 2, or 4) at an interface with the Cu or Cu-alloy member, and an electronic device and a semiconductor device including the solder joining.

Solder joining

A semiconductor device is provided, including: a bottom portion having a pad formed of a conductive material; a lid portion covering at least a part of the bottom portion; and a first terminal portion and a second terminal portion which are provided in parallel with each other, are fixed to the lid portion, and each contact a corresponding pad, wherein: the first terminal portion is provided with a first plate-shaped portion; the second terminal portion is provided with a second plate-shaped portion; and each of the first plate-shaped portion and the second plate-shaped portion has a principal surface in a direction facing the pad and is flexible in a direction toward the pad.

There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.

Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device

When a nut housing member is inserted from a first opening portion into a case (terminal housing area) in a semiconductor device, first and second protrusions of the nut housing member slide on and pass through the first and second opening portions. Ultimately, the nut housing member is housed in the case (terminal housing area), with the first protrusion being in contact with a lower end of the second opening portion and the second protrusion being in contact with a lower end of the first opening portion. Even if the nut housing member is not inserted in parallel with the terminal housing area, the forefront does not hit against a first beam. Therefore, the nut housing member is inserted stably and housed reliably in the terminal housing area of the case, and the assemblability of the nut housing member with respect to the case is improved.

A semiconductor deviceincludes: multi-layered substrateseach having a circuit board; control terminalswhose one end is fixed on the circuit boardof each multi-layered substrate; a resin casewhich has openingsand is arranged to cover the multi-layered substrates, through which openingsthe other ends of the control terminalsextend outwardly; and resin blockswhich are each inserted into the openingsof the resin caseand press-fixes the control terminalsagainst the side walls of the respective openings. The control terminalseach have a low-rigidity portionat a position that is further interior of the resin casethan a position where each control terminalis in contact with the resin blockin the respective openingsof the resin case

A control terminalof a semiconductor device has a recessed portion. A resin caseis provided with a fixing memberengaging with and fixing a recessed portionof a control terminal. The fixing memberis constituted by a resin block portionhaving a step portion engaging with the recessed portion, a nut-housing portion, and a beam portionintegrated by linking the resin block portionand the nut-housing portion. A resin case main bodyto which the fixing memberis fixed is provided with a hollow portion enabling insertion of the resin block portion. The nut-housing portionof the fixing memberand the resin block portionare attached to the resin case main bodyfrom one direction.

Provided are a semiconductor device including a terminal, a circuit substrate, and a case body and a method for manufacturing the semiconductor device. A semiconductor device () includes a terminal (), a circuit substrate (), a case body (), and a positioning component (). The terminal () includes a first end portion (), a trunk portion (), and a second end portion (). The first end portion () of the terminal () is secured to the circuit substrate (). The case body () includes a main surface (), an opening portion () on a side opposing the main surface (), and a groove hole () on the main surface () side. A sidewall () and a through hole () are formed in the groove hole (). The terminal () passes through the through hole () toward the main surface () side from the opening portion () side of the case body (), and the second end portion () protrudes from the main surface () of the case body (). The positioning component () with an inclined protrusion portion () formed thereon is secured in the groove hole (). The trunk portion () of the terminal () is pressed by the inclined protrusion portion () of the positioning component () in a direction of the sidewall () of the groove hole () to be sandwiched between the inclined protrusion portion () and the sidewall () and supported in the groove hole ().

Semiconductor device and method for manufacturing same

A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.

Aspects of the invention are directed to a power module including a metal base, an insulating substrate which is attached to the metal base, a semiconductor chip and a control terminal which are attached to a circuit pattern of the insulating substrate, and a resin case which is attached to the metal base. The control terminal can include a penetration portion which penetrates a cover of the resin case, an L-shaped processed portion which is connected to the penetration portion, and a connection portion which is connected to the L-shaped processed portion. A protrusion portion can be installed in a portion of the control terminal, which penetrates the cover. The protrusion portion can be in contact with a protrusion receiving portion which is configured with a front surface of the cover. The L-shaped processed portion can be in contact with a convex portion in a rear surface of the cover.

A method of manufacturing a semiconductor device, includes the steps of passing a control terminal through an opening of a resin case to partially expose the control terminal and covering a patterned insulating substrate with the resin case; inserting a resin block in the opening of the resin case; fitting a convex step portion formed on a side surface of the resin block into a valley formed between two projections of the control terminal; fitting a projection formed on the side surface of the resin block into a concave portion formed on a sidewall of the opening of the resin case; and fitting a projection formed on a bottom surface of the resin block into a concave portion formed in a beam portion at a bottom portion of the opening of the resin case to position and fix the control terminal.

Semiconductor device manufacturing method

A semiconductor device has a control terminal attached to a patterned insulating substrate; a first projection formed on the control terminal; a second projection formed on the control terminal; a concave formed between the first projection and the second projection; a resin case disposed to cover the patterned insulating substrate, and having an opening for passing the control terminal therethrough; a first concave portion; a beam portion disposed at the opening of the resin case; a second concave portion formed in the beam portion; a resin block inserted into the opening of the resin case and sandwiching the control terminal together with the sidewall of the opening of the resin case to fix the control terminal to the resin case; a convex step portion; a third projection formed on a side surface of the resin block; and a fourth projection thinned on a bottom surface of the resin block.

Growing community of inventors

Matsumoto, Japan

Yoshihiro Kodaira