Matsushita Electric Works, Ltd.

Yoshihiro Kitsuda

Katsuya Tsukamoto

Yasuhiro Fujii

Kyoji Masamoto

Toshio Abiko

Masayuki Matsuo

Masahiro Matsumura

Yasumasa Ogawa

Sadaaki Kondo

Hiroshi Yokota

Hajime Takeda

Shoji Miyanari

Takahisa Kouyama

Masaaki Ohtsu

Kyozi Masamoto

Masakatsu Niwa

Shuji Taniguchi

A planar antenna comprises a ground conductor plate, a power supply circuit and a radiation circuit. Each of those circuits is coated on both sides with synthetic resin layers. The circuits are separated from each other by a first air space. The power supply circuit and ground conductor plate are separated from each other by a second air space. Air present in the space operates as a low loss dielectric to achieve a high gain.

Planar antenna

A plane antenna comprises a power-supply circuit, a radiator circuit and an earthing conductor which are stacked respectively with a dielectric layer interposed between them, in which the power-supply and radiator circuits are made independent of each other as electromagnetically coupled to each other and at least one of the dielectric layers is formed with a foamed resin, whereby insertion loss can be reduced to remarkably improve the antenna characteristics. Only with the interposition of the foamed resin dielectric layer or layers, an effective separation is achieved between at least the power-supply circuit and the earthing conductor or the power-supply circuit and the radiator circuit, for a large extent improvement in the assembling ability.

A microwave plane antenna comprising antenna body including a plurality of conductive microstrip lines covered with a plastic film and a polyolefin series dielectric layer provided along the microstrip lines for lowering SHF band transmission loss while elevating reception gain. The antenna is enclosed in a plastic cover which includes portions constructed to permit the passage of microwaves while imparting appreciable strength to the cover.

Microwave plane antenna

An epoxy resin composition containing one or a mixture thereof selected from the group consisting of poly-p-vinyl phenol and its halides, and a compound selected from the group consisting of the following compounds: (a) Sn salt of organic acid wherein at least one organic group is bonded with Sn atom; (b) alcoxy-containing silane compound represented by the general formula, (R'--).sub.n --Si--(--OR).sub.4-n, wherein R' denotes the alkyl group or the allyl group, R denotes the normal chain or branched alkyl group, and n denotes 0 or an integer of 1-4; and (c) aluminic acid ester represented by the general formula, [Al(OR).sub.3 ].sub.n, wherein n denotes an integer of 1-5, and R denotes the alkyl group or allyl group. The present invention further includes a method for preparing an epoxy resin prepreg using the above epoxy resin composition.

Epoxy resin composition

A phenol-formaldehyde composition useful as a raw material for the preparation of phenolic resins, which comprises one or more phenols and not more than about 6 moles of formaldehyde per 1 mole of said one or more phenols, and, as optional components, not more than about 7 moles of water and not more than about 7 moles of methanol per 1 mole of said one or more phenols, the composition being obtained by dissolving formaldehyde into the one or more phenols, optionally with water or water plus methanol.

Phenol-formaldehyde composition useful as a raw material for the

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Kadoma, Japan

Yoshihiro Kitsuda