Nichia Corporation

Nikon Corporation

Shiseido Company, Limited

Yoshihiro Kimura

Tadaaki Miyata

Masatoshi Nakagaki

Masaaki Ishiwatari

Masayuki Akagawa

Yoshiyuki Ogusu

Yuji Tsutsumi

A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.

Method for manufacturing semiconductor device with submount including groove on surface of submount having heat dissipation portion

A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.

Light source device and method of manufacturing the same

A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

Semiconductor device and method for manufacturing semiconductor device

A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.

A light source device includes: first and second laser diodes; a reflector having: first and second reflecting faces configured to reflect a portion of light from the respective first and second laser diodes and to transmit a portion of the light from the respective first and second laser diodes, and first and second exit faces configured to allow the portions of the light transmitted through the respective first and second reflecting faces to exit; and a photodetector including: first and second light receiving element configured to receive light exiting the first and second exit faces, respectively. The reflector is configured such that the light transmitted through the first reflecting face is hindered from exiting the second exit face and the light transmitted through the second reflecting face is hindered from exiting the first exit face.

Light source device

A light source device includes: a laser diode; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode. The cap includes a first glass portion configured to transmit laser light that is emitted from the laser diode, and a second glass portion. At least one of the first glass portion and the second glass portion includes an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region.

Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.

A light source device includes: a base member; a semiconductor laser mounted on an upper surface of the base member; a lateral wall portion having: a lower surface facing the upper surface of the base member and being a non-reflecting surface, and a reflecting surface that reflects light emitted from the semiconductor laser, is connected to the lower surface of the lateral wall portion at a lower end portion of the reflecting surface, and is inclined with respect to the upper surface of the base member; a first bonding film that is a metal film disposed in a region on the upper surface of the base member facing the lower surface of the lateral wall portion; a second bonding film that is a metal film disposed on the lower surface of the lateral wall portion; and a metal bonding member fuse-bonded to the first bonding film and the second bonding film to each other. An end portion of the first bonding film at a reflecting-surface side and an end portion of the second bonding film at the reflecting-surface side are located separately from the lower end portion of the reflecting surface. A distance between the end portion of the first bonding film at the reflecting-surface side and the lower end portion of the reflecting surface is different from a distance between the end portion of the second bonding film at the reflecting-surface side and the lower end portion of the reflecting surface.

A pellicle pasting system and method pastes a pellicle on a mask. The system includes a washing apparatus to wash the mask; a first mask transport apparatus to transport the mask washed by the washing apparatus; a first inspection apparatus to inspect whether foreign objects are attached to the mask received from the first mask transport apparatus; a second mask transport apparatus to transport the mask when the first inspection apparatus determines that the foreign objects are substantially absent from the mask; and a pellicle pasting apparatus to paste the pellicle on the mask received from the second mask transport apparatus.

Pellicle pasting system and method

A cosmetic composition comprising at least one fluorocarbon having the formula C.sub.n H.sub.p F.sub.q X.sub.4 wherein X represents chlorine or bromine, n is an integer of 1 to 8, q is an integer of 1 to 18, and p+q+r is an 2n+2, which is liquid at an ambient temperature and has a boiling point of 200.degree. C. or less, in the composition. This cosmetic composition does not exhibit an unpreferable oily feeling finish but does exhibit a cosmetic finish which lasts for a long time.

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Yokohama, Japan

Yoshihiro Kimura