Mitsubishi Gas Chemical Company, Inc.

Sony Corporation

Other

Adv Antest Corporation

Sony Mobile Communications Inc.

Yoshihiro Kato

Takaaki Ogashiwa

Katsumi Okayama

Masanobu Sogame

Yoshinori Mabuchi

Hiroshi Takahashi

Morio Gaku

Nobuyuki Ikeguchi

Masayoshi Ueno

Chisato Saito

Yasuo Tanaka

Yoshinori Ito

Kazuhiko Suzuki

Hiroaki Kobayashi

Yoshito Ikeda

Eisuke Shiga

Meguru Ito

Tetsuya Yamamoto

Takeshi Maeda

Takashi Kobayashi

Koichi Ito

Makoto Suzuki

Kazuhiro Nakamura

Shinichi Fukuda

Takanori Washiro

Yoshitaka Yoshino

Yuki Watanabe

Kenichi Kabasawa

Tomomichi Murakami

Minoru Ikarashi

Yusuke Suzuki

Keisuke Takada

Koji Morishita

Yuko Yoshida

Satoshi Konya

Tatsuo Kumura

Junichi Toyoda

Kenzoh Nishikawa

Naoya Kimura

Masayuki Katagiri

Yousuke Matsuyama

Yuuichi Sugano

Tatsushiro Hirata

Taketo Ikeno

Seiji Shika

Syunsuke Hirano

Kazuaki Kawashita

Kaoru Kobayashi

Takeshi Nobukuni

Tetsuro Miyahira

Masaki Orihashi

Koichiro Inomata

Satoshi Sugimoto

Daisuke Ueyama

Tomoki Hamajima

Youichi Nakajima

Shigeru Horie

Yusuke Kubo

Tomo Chiba

Kenji Ishikura

Makoto Tsubuku

Masaya Takano

Kotaro Fujimori

Naoki Kashima

Keita Tokuzumi

Kentaro Nomizu

Keiichi Hasebe

Keisuke Matsunami

Taro Yoshida

Hidetoshi Kawai

Kenji Arii

Yuichiro Harada

Seigo Fukunaga

Shuichi Inage

Shunsuke Hirano

Kazuhiro Iezumi

Kenj Arii

Tomoyuki Itakura

Koji Miyauchi

Noriyuki Mukai

Takashi Miyazaki

Hiroki Aoto

Yoichi Nakajima

Makoto Murakami

Takaaki Ichikawa

Keisuke Kusunoki

Kazuhiro Tsujikawa

Yuichi Koga

A method for producing a package substrate for mounting a semiconductor device includes:

Method for producing package substrate for mounting semiconductor device

A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

Method for producing package substrate for loading semiconductor device

Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 μm; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 μm.

Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same

The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 &#x3bc;m and a second metal foil laminated in this order, and patterning the second metal foil.

Method for producing laminate having patterned metal foil, and laminate having patterned metal foil

A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device

The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).

Method for producing printed wiring board

A test apparatus is configured to test a DUT that does not support synchronous control from an external circuit. A main controller is configured based on an architecture that tests a device by synchronous control with the main controller itself as the master. A MIU is configured as an interface between the main controller and the DUT. The MIU establishes asynchronous control between it and the DUT with the DUT as the master, and establishes control between it and the main controller with the main controller as the master.

Test apparatus and test method

A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).

Support and method for producing semiconductor device-mounting substrate using the same

An electronic member provided in a circuit board having a connector. The connector has a card mounting port and holds a memory card in a state where a tip of the memory card is exposed from the card mounting port at a connection position where a connection terminal of the memory card and a connection terminal of the circuit board are connected. The electronic component includes a device that adds capacitance at a position separated from and facing at least a part of the tip of the memory card, in a state where the memory card is held at the connection position by the connector, and a connector having first and second end portions in which the first end portion is connected to the device that adds capacitance and the second end portion is connected to a ground of the circuit board.

Electronic component to reduce noise caused by the tip end of a memory card

A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermediate laminate.

Methods for producing laminate and substrate for mounting a semiconductor device

A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C);

Prepreg, metal foil-clad laminate, and printed wiring board

A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 &#x3bc;m to 5 &#x3bc;m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.

Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate

The present invention provides a cutting method comprising a cutting step of cutting a workpiece material with a cutting tool to thereby form a through-groove in the workpiece material, wherein in the cutting step, the through-groove is formed in the workpiece material by cutting the workpiece material with the cutting tool while contacting a cut-assisting lubricant with the contact portion of the cutting tool with the workpiece material and/or the contact portion of the workpiece material with the cutting tool, and the workpiece material comprises a fiber reinforced composite material.

Cutting method for fiber reinforced composite material

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Resin composition, prepreg, and laminated sheet

An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board

Growing community of inventors

Tokyo, Japan

Yoshihiro Kato