Mitsubishi Shindoh Co., Ltd.

Yoshihiro Kameyama

Takeshi Sakurai

Yoshio Abe

Akira Saito

The Cu&#x2014;Ni&#x2014;Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of &#x2159; to &#xbc; of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2&#xb0; to 1.5&#xb0;, and the ratio (L&#x3c3;/L) of the total special grain boundary length L&#x3c3; of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mmto 600 N/mm, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150&#xb0; C. for 1000 hours.

Cu-Ni-Si-based copper alloy plate having excellent deep drawing workability and method of manufacturing the same

A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4&#xb0; is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5&#xb0; or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm, and a bending elastic limit value is 472 to 503 N/mm.

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Aizuwakamatsu, Japan

Yoshihiro Kameyama