Shinko Electric Industries Co., Ltd.

Nihon Kohden Corporation

Yoshihiro Ihara

Tsuyoshi Kobayashi

Tomoharu Fujii

Yasuyoshi Horikawa

Kazuyuki Kubota

Takeo Kanazawa

Kei Murayama

Hideaki Sakaguchi

Takaharu Yamano

Norihito Konno

Shinichi Wakabayashi

Masato Tanaka

Mitsuhiro Aizawa

Kenichi Mori

Shoji Watanabe

Hikaru Tanaka

Takehito Terasawa

Masakuni Kitajima

Koji Hara

Akira Fujisawa

Tsuyoshi Shibamoto

Yoshihiro Kita

Kenji Mochizuki

A semiconductor device includes a wiring substrate and multiple semiconductor chips mounted on the wiring substrate by flip chip bonding with a resin being interposed between the wiring substrate and the semiconductor chips. The wiring substrate includes a chip mounting region in which the semiconductor chips are arranged in a matrix, and a resin injection region protruding from an end of the chip mounting region. The outer edge of the wiring substrate in the chip mounting region is positioned inward of the outer edge of the semiconductor chips arranged in the matrix. The outer edge of the wiring substrate in the resin injection region protrudes outward of the outer edge of the semiconductor chips arranged in the matrix.

Semiconductor device and semiconductor device array

A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.

Folded substrate for stacked integrated circuit devices

A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.

Bioelectrode component

A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells.

Battery and method for producing the same

A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

Circuit board module

A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.

Sensor including a peelable insulation sheet

A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation component arranged on the wiring substrate. The heat dissipation component includes a cavity that accommodates the semiconductor element and includes an inner surface opposing the wiring substrate. The semiconductor element is located between the inner surface of the cavity and the wiring substrate. A heat conductor is bonded to the semiconductor element and to the inner surface of the cavity. The heat conductor includes linear heat conductive matters arranged between the semiconductor element and the heat dissipation component. A first alloy layer bonded to the semiconductor element covers lower ends of the heat conductive matters. The heat dissipation component includes a through hole extending through the heat dissipation component toward the heat conductor from a location outside of the heat conductor in a plan view.

Semiconductor device, heat conductor, and method for manufacturing semiconductor device

A semiconductor device includes a support body provided with a wiring layer that includes a first pad; a first semiconductor chip; a first relay substrate stacked on the first semiconductor chip through a first non-conductive adhesion layer and including a first conductive portion and a first protruding electrode electrically connected to the first conductive portion; a second semiconductor chip stacked on the first relay substrate through a second non-conductive adhesion layer, the first protruding electrode of the first relay substrate penetrating the second non-conductive adhesion layer to be connected to the second semiconductor chip; and a first metal wire formed at the first relay substrate to be connected to the first conductive portion for electrically connecting the first conductive portion with the first pad of the wiring layer of the support body.

Semiconductor device including semiconductor chips stacked via relay substrate

A semiconductor device includes a wiring substrate. The wiring substrate includes a first surface, a second surface located at an opposite side of the first surface, a cavity formed in the first surface, an electrode pad formed on the first surface surrounding the cavity, and a high frequency wire exposed on the first surface. A semiconductor element is accommodated in the cavity. A bonding wire connects the semiconductor element and the electrode pad. A first protection film is arranged on the first surface of the wiring substrate to cover the first surface, the semiconductor element, the electrode pad, the bonding wire, and the high frequency wire.

Semiconductor device

There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough.

Socket and semiconductor device provided with socket

A connection terminal structure includes a support member including a first surface and an opening part formed in the first surface, and at least one connection terminal formed on the first surface, the connection terminal including a fixing part, a connection part configured to connect to a connection object, and a spring part communicating between the fixing part and the connection part. The spring part and the connection part are bent upward together with the support member and project toward the connection object. A portion of the fixing part is exposed in the opening part.

Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate

A substrate includes a substrate base, first contact parts arranged in a pattern on a surface of the substrate base, and leads respectively having a generally U-shape with a flexible part, a first end fixed to a corresponding one of the first contact parts, and a second end that is located a predetermined distance away from the first end relative to the surface of the substrate base. The first and second ends of each of the leads are substantially aligned in a direction perpendicular to the surface of the substrate base in a state where the second end of each lead is pushed by a target object and deformed thereby in order to electrically connect the substrate to the target object.

Substrate having leads

A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.

Socket and method of fabricating the same

A semiconductor device includes: an electronic component including an electrode pad forming face on which electrode pads are formed, a back face opposite to the electrode pad forming face; a sealing resin including a first face provided on the electrode pad forming face side and a second face provided on the back face side, and provided around the electronic component to seal up a side face of the electrode component; a multilayer wiring structure which is provided on the first face, and in which insulating layers, a wiring pattern and external connecting pads are stacked on each other; and a conductive member which is provided in a through-hole passing through the sealing resin and the insulating layer. The wiring pattern is directly connected to the electrode pads and the external connecting pads, and includes a wiring provided in the insulating layers. The conductive member is connected to the wiring.

Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure

A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.

Growing community of inventors

Nagano, Japan

Yoshihiro Ihara