Kyocera Corporation

Kyocera Slc Technologies Corporation

Yoshihiro Hosoi

Masaaki Harazono

Yasuo Fukuda

Hiroshi Matsumoto

Hidetoshi Yugawa

Takayuki Taguchi

Takayuki Nejime

Kenji Masuri

Kazuhito Imuta

Takaaki Fujioka

Yuki Takeshima

Kyohei Yamashita

Hisashi Kojima

A wiring substrate includes an insulating substrate, a conductor layer and an interlayer. The insulating substrate contains AlN. The conductor layer contains Cu. The interlayer is located between the insulating substrate and the conductor layer. In the interlayer, between a first region near the insulating substrate and a second region near the conductor layer, Cu concentration is higher in the second region than in the first region, and Al concentration is higher in the first region than in the second region.

Wiring substrate, electronic device, and electronic module

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.

Wiring board and electronic device using the same

A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor.

Printed circuit board, mount structure thereof, and methods of producing these

A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole.

Wiring board and mounting structure using the same

A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.

Circuit board and mounting structure using the same

An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of the wiring conductor with an electroless plated metal layer, wherein the electroless plated metal layer contains an element of Group 1B and is free from lead.

Method for producing wiring substrate

Wiring substrate

A semiconductor device including an insulating substrate which has a semiconductor element-mounting portion for mounting a semiconductor element on the center of its top surface, and a plurality of metallized wiring layers which lead outward extendedly from the periphery of the semiconductor element-mounting portion to the rim of the top surface; a semiconductor element which is mounted on the semiconductor element-mounting portion and has electrodes connected to the inner end sections of the metallized wiring layers; a plurality of outer lead terminals which are attached to the outer end sections of the metallized wiring layers to connect the semiconductor element to an exterior electric circuit; and a molding resin which covers the insulating substrate, the semiconductor element and part of the outer lead terminals.

Semiconductor device having improved heat resistance

A surface metal layer composed mainly of gold is formed on the surface of a metallized metal layer on an insulating substrate through a first intermediate metal layer composed of a nickel/boron alloy and a second intermediate metal layer composed of a nickel/phosphorus alloy. In this surface layer, appearance of stains or occurrence of blistering is prevented, and this surface metal layer is excellent in appearance characteristics, electric characteristics and durability.

Growing community of inventors

Kirishima, Japan

Yoshihiro Hosoi