Sumitomo Electric Industries, Limited

Mitsubishi Denki Kabushiki Kaisha

Vlsi Technology Research Association

Yoshihiro Hirata

Junichi Arima

Shigeru Harada

Tsuyoshi Haga

Hiroshi Harada

Kazunori Okada

Jun Yorita

Reiji Tamaki

Isao Furuta

Shinji Inazawa

Kazuo Nakamae

Hajime Arai

Takeshi Noguchi

Masanori Obata

Masanobu Tosa

Hidefumi Kuroki

Kenji Saitoh

Koji Nitta

Hideaki Arima

Tadashi Nishimura

Takaaki Fukumoto

Masahiro Yoneda

Masahiko Denda

Haruhiko Abe

Yoichi Akasaka

Eisuke Tanaka

Shigeji Kinoshita

Hisao Yakushiji

Masao Sakuta

Toshiyuki Numazawa

Jyunichi Arima

Yoshiaki Tani

Kuniaki Miyake

Teruhisa Sakata

Tetsuji Ueno

Kazunori Kawase

A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.

Metal structure and fabrication method thereof

A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.

Method of manufacturing electrical parts

According to an embodiment, a probe coming into contact with an electrode pad of a measurement object comprises a connection terminal part integrally formed and connected to a substrate, a contact part having a tapered configuration, and a supporting part which supports the contact part. The contact part extending from an end of the supporting part has a sectional configuration which shares at least one side face with the supporting part.

Probe

A method of manufacturing a metal microstructure () by using a resin mold (). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold () can be set and the high-precision metal microstructure () can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure () according to the present invention includes the steps of: fixing on a conductive substrate () the resin mold () having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer () having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure () having the resin mold (); exposing the layered structure () having the resin mold () to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer () existing at the vacant portion of the resin mold (); and filling with a metal () the vacant portion of the layered structure () having the resin mold () by electroforming.

Method for manufacturing metal microstructure

A method of manufacturing a contact probe includes an electroforming step of, using a resist film () arranged on a substrate () as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film () to form a metal layer (), a tip end shaping step of obliquely removing and sharpening that part of the metal layer () which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer () from the pattern frame.

Contact probe, method of manufacturing the contact probe, and device and method for inspection

A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

In a method for manufacturing ceramic components, a resin mold is initially filled with a paste containing a ceramic material. Next, a ceramic powder is applied on the paste. The ceramic powder and paste are then press-formed and removed from the resin mold. Finally, the ceramic powder and paste are baked. The method allows manufacturing of ceramic components having a microstructure without collapse. Additionally, ceramic components having a large area can be manufactured without warping.

Manufacturing method of ceramics component having microstructure

A microconnector provides a practically sufficient strength, and has an arrangement in which structures of electrode members and guiding members can be designed at least somewhat independently of each other for allowing a simple connecting operation. In a male connector, wiring layers are formed on a substrate, and male pin connector electrodes project from the wiring layers, whereby the electrodes are two-dimensionally arranged and enclosed with spacers. In a female connector, on the other hand, wiring layers are formed on a substrate, and female connector electrodes are formed on single ends of the wiring layers respectively. The female connector electrodes comprise holes for receiving the pin electrodes, and are arranged in correspondence to the pin electrodes. The female connector electrodes each having a spring characteristic and are enclosed with spacers. The male and female connectors are electrically connected with each other by superposing the substrates with each other while orienting electrode surfaces thereof to be opposed to each other. The pin electrodes and the female connector electrodes are naturally aligned and brought into engagement with each other due to attraction of magnetic layers formed on the male and female connectors respectively.

Microconnector and method of manufacturing the same

In a composite ultrasonic transducer, each of a plurality of piezoelectric ceramic columns included in a resin plate has a given circular cross-section and passes through the resin plate in a direction of a thickness of the resin plate, and central axes of the piezoelectric ceramic columns are regularly arranged at positions corresponding to nodes of a regular triangle network.

Composite ultrasonic transducer

A method of forming a fine ceramics structure having columns with a fine pattern of width and a high aspect ratio includes steps of charging a plastic mold with a ceramics slurry, solidifying the ceramics slurry, and thereafter removing the plastic mold. The plastic mold is removed by heating the plastic mold in a vacuum, employing laser ablation, employing plasma etching, or employing a solvent of low viscosity dissolving plastic mold. Especially, the plastic mold is made of acrylic, the ceramics structure is made of lead zirconate titanate, and the mold is removed by laser ablation. The resulting fine pattern ceramics structure may have columns with an aspect ratio of at least 10, and particularly a height of 100 .mu.m and a diameter of 10 .mu.m.

Method of forming fine ceramics structure

A method of forming a fine ceramics structure having columns with a fine pattern of width and a high aspect ratio includes steps of charging a plastic mold with a ceramics slurry, solidifying the ceramics slurry, and thereafter removing the plastic mold. The plastic mold is removed by heating the plastic mold in a vacuum, employing laser ablation, employing plasma etching, or employing a solvent of low viscosity dissolving plastic mold. Especially, the plastic mold is made of acrylic, the ceramics structure is made of lead zirconate titanate, and the mold is removed by plasma etching in a gas environment of oxygen and freon. The resulting fine pattern ceramics structure may have columns with an aspect ratio of at least 10, and particularly a height of 100 .mu.m and a diameter of 10 .mu.m.

In an automatic thin-film measuring apparatus, the zero point of a precision balance is corrected according to directions from a data processing unit before and after the weight of a semiconductor substrate is measured, the surface temperature of the semiconductor substrate laid on a pan of the precision balance is measured, and the weight of the semiconductor substrate is measured when the surface temperature reaches a predetermined value. Furthermore, the cycle of variations in the zero point is found when the zero point is corrected, and the weight measurement of the semiconductor substrate is conducted during an integer multiple of the change cycle. Therefore, it is possible to enhance the precision of the weight measurement and its reproducibility and to shorten the measurement time without being influenced by low-frequency vibrations.

Automatic thin-film measuring apparatus

A semiconductor device which includes an electrode portion formed on a wafer; a passivation film deposited on said wafer except for said electrode portion; an insulating film deposited only on said passivation film so as to have a predetermined thickness and so as to include a concave portion over said electrode portion; and conductive material embedded in said concave portion at least up to the height of said insulating film, wherein the conductive material is intended to be used for bonding to a substrate.

Method of producing semiconductor device

In a method of forming a metallic silicide film on a substrate, a metallic silicide film containing silicon at a concentration higher than stoichiometric, is deposited on a substrate. A film of aluminum or aluminum alloy is then deposited on the metallic silicide film. Subsequently, a heat treatment is conducted to cause precipitation of silicon from the metallic silicide film to the aluminum, thereby to lower the silicon concentration in the silicide film.

Method of forming a silicide film

A homogeneous fine grained metal film (6') on a substrate in accordance with the present invention comprises multiple metal layers and intervening layers (14) between the respective metal layers, the intervening layers being formed of a compound of the metal and a reactive gas and serving to suppress growth of grains (12') in the respective metal layers and to suppress electromigration of grain boundaries (13'). In a method for manufacturing a metal film (6') having homogeneous and fine grains on a substrate in accordance with the present invention, one or more intervening layers (14) are formed by introducing a gas reactive with the metal film one or more times during deposition of the metal film, whereby intervening layers of a metal compound are interposed between the successively deposited metal layers. Thus, a metal film of multilayered structure including multiple metal layers separated by the intervening layers is formed.

Growing community of inventors

Hyogo, Japan

Yoshihiro Hirata