Matsushita Electric Industrial Co., Ltd.

Yoshihiro Higuchi

Masakazu Tanahashi

Tsunenori Yoshida

Kenji Hoshino

Tsuyoshi Yoshino

Tsuneshi Nakamura

Yoshitsugu Uenishi

Minoru Omori

Masashi Kadoya

A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.

Solid electrolytic capacitor and method of manufacturing same

An anode for an electrolytic capacitor includes a porous body having micropores that include a dielectric layer filled thereon and an electrolyte filled therein. The porous body includes a laminate of a plurality of sinter layers having the micropores formed from valve metal particles. The laminate includes alternating smaller micropore-size regions and larger micropore-size regions, which form electric conductive passages between the smaller micropore-size regions and side surfaces of the porous body. This structure reduces resistance of the capacitor and also increases capacitance by effectively utilizing the capacitance of the smaller micropore-size regions. The porous body is formed by stacking a plurality of porous preforms, such as sheets preformed of valve metal powder, into a laminate, and then sintering the laminate. The porous body may be joined with a valve metal substrate during sintering, thereby completing the anode for an electrolytic capacitor. Particularly, the porous body may be a laminate including larger micropore-size sinter layers and smaller micropore-size sinter layers, by alternatively laminating two types of preforms, each having a different density.

Electrode for electrolytic capacitor and process of producing the same

An anodic electrode for an electrolytic capacitor having high capacitance with low-resistance properties at high frequencies and capable of carrying large current, and a process of producing the same. Such an anodic electrode for electrolytic capacitor includes a porous body having micropores to be formed with a dielectric layer therein and to be filled with electrolyte therein, wherein the porous body includes a laminate of a plurality of sinter layers having the micropores formed from valve metal particles. The laminate includes multilaminarly smaller micropore-size regions and larger micropore-size regions to form electric conductive passages between the small micropore-size regions and side surfaces of the porous body to reduce resistance of the capacitor and also increase capacitance by utilizing the smaller micropores-size regions for capacitor effectively. The porous body is formed by stacking a plurality of porous preforms such as sheets preformed of valve metal powder into a laminate, and then sintering the laminate. The porous body may be joined with a valve metal substrate during sintering, thereby completing the anodic electrode for an electrolytic capacitor. Particularly, the porous body may be a laminate including large micropore-size sinter layers and small micropore size sinter layers, by alternatively laminating two types of preforms different in density.

Electrode for electrolytic capacitor

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Otsu, Japan

Yoshihiro Higuchi