Canon Components, Inc.

Yoshihiro Hattori

Yoshihisa Negishi

Junichi Kato

Hiroyuki Murakami

Taisuke Iwashita

Shozo Asai

Kenichi Matsumoto

Masashi Ishimaru

Naoki Tatebayashi

A line sensor apparatus comprises a rod lens array in which a plurality of rod lenses are arrayed in a first direction, a line sensor substrate including a line sensor which receives light from the rod lens array, a pair of inner supporting members configured to support the line sensor substrate, a transmitter substrate including a transmitter which transfers data based on the light detected by the line sensor, and an outer supporting member configured to support the pair of inner supporting members and the transmitter substrate, wherein the pair of inner supporting members are arranged on two side surfaces of the rod lens array in a second direction perpendicular to the first direction.

Line sensor apparatus, reading apparatus, and recording system

Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveyance path; an imaging unit that images the recording paper; and a light emitting unit arranged on an opposite side of the imaging unit across the conveyance path, wherein the control unit detects conveyance information of the recording paper based on image information of the recording paper imaged by the imaging unit in a state in which light from the light emitting unit is transmitted through the recording paper. The control unit detects the conveyance information of the recording paper based on a plurality of images of the recording paper imaged at different timings by the imaging unit.

Conveyance detection apparatus, conveying apparatus, and recording apparatus

There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

Method for processing resin product and resin product

A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

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Saitama, Japan

Yoshihiro Hattori