Kyocera Corporation

Casio Computer Co., Ltd.

Yoshihiro Basho

Ryuji Mori

Toshihiro Hashimoto

Masaaki Miyahara

Naotomo Miyamoto

Masaharu Shioya

Tadao Yamamoto

Kaoru Saito

Atsushi Ogasawara

Masahiko Miyauchi

The invention relates to a reaction apparatus that efficiently heats a reaction portion, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus () includes a reformer () in which formed are a reforming reaction chamber () and a reformer combustion chamber () that generates heat to be supplied to the reforming reaction chamber (), which () are adjacent to each other with a partition interposed therebetween; a CO remover () in which formed are a removing reaction chamber () where a chemical reaction is performed at a temperature lower than that in the reforming reaction chamber () and a remover combustion chamber () that generates heat to be supplied to the removing reaction chamber (), which () are adjacent to each other with a partition interposed therebetween; and a connecting portion () that connects the reformer () and the remover (). At least one of the reformer () and the CO remover () is configured by combining ceramic parts () and metal components (), and the ceramic parts () and the metal components () are connected with second members () interposed therebetween.

Reaction apparatus, fuel cell system and electronic device

There are provided a fuel reformer housing container and a fuel reforming apparatus, which are capable of maintaining a level of vacuum inside the fuel reformer housing container favorably and which have less power generation loss. A fuel reformer housing container includes a base having a concave portion for housing a fuel reformer in which reformed gas containing hydrogen gas is generated from fuel, a discharge pipe for communicating inside of the concave portion with outside thereof to discharge the reformed gas from the fuel reformer, a supply pipe for communicating inside of the concave portion with outside thereof to supply the fuel to the fuel reformer, and a gas adsorbent housed in the concave portion, for adsorbing gas in the concave portion.

Fuel reformer housing container and fuel reforming apparatus

A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.

Heat releasing member, package for accommodating semiconductor element and semiconductor device

Growing community of inventors

Kirishima, Japan

Yoshihiro Basho