Murata Manufacturing Co., Ltd.

Yoshihiro Aoyama

Noboru Kato

Hirokazu Yazaki

Noriyuki Ueki

Mikiko Saito

Junya Shimakawa

A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.

Circuit module and RFID tag

A wireless communication device is provided for transmitting and receiving a high-frequency signal having a first frequency for communication is disclosed. The device includes a loop pattern having a first electrode and a second electrode as both ends, an antenna pattern, a third electrode capacitively coupled to the first electrode, and a fourth electrode capacitively coupled to the second electrode. The device includes an RFIC having a capacitive impedance at a second frequency higher than the first frequency, and a first current path and a second current path connected in parallel with each other between the third electrode and the fourth electrode. The RFIC is included in the first current path and the second current path has an inductive impedance at a second frequency.

Wireless communication device using a radio frequency identification (RFID) technology for data communication in a non-contact manner by an induction electromagnetic field or a radio wave

In an impedance matching circuit, first to fourth inductors are formed by a conductor pattern of a coil shape, and a fifth inductor is formed by a conductor pattern of an unwound shape. The first inductor and the third inductor are respectively formed in different layers of a substrate and are arranged in such a relationship as to have coil openings overlapping each other. Moreover, the second inductor and the fourth inductor are respectively formed in different layers of the substrate and are arranged in such a relationship as to have coil openings overlapping each other. Two coils interposing the mounting position of the RFIC are in a 180&#xb0; rotational symmetry relationship.

RFIC module and RFID tag

Based on a result of repeated analysis of stress caused by application of an external impact in a circuit board, which is rectangular or substantially rectangular in plan view and includes mounting electrodes, included in an electronic component, the mounting electrodes near four corners of the circuit board, of the mounting electrodes provided on a back surface of the circuit board included in the electronic component, are provided at positions shifted from diagonal lines of the back surface. Hence, the stress produced near the four corners of the circuit board is reduced, and this can effectively prevent a fracture, a chip, and a crack from being caused in the circuit board.

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Nagaokakyo, Japan

Yoshihiro Aoyama