Renesas Northern Japan Semiconductor, Inc.

Renesas Technology Corp.

Other

Renesas Electronics Corporation

Hitachi, Ltd.

Hitachi Yonezawa Electronics Co., Ltd

Yoshihiko Yamaguchi

Noriyuki Takahashi

Mitsuru Kinoshita

Tadashi Munakata

Shingo Oosaka

Takao Matsuura

Kouji Tsuchiya

Shouichi Kobayashi

Atsushi Fujishima

Yusuke Ohta

Hiromichi Matsuda

Masahide Koya

Masaki Ushio

A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.

A semiconductor device manufacturing apparatus includes a pre-alignment section having a pre-alignment camera which is adapted to recognize marks formed on a multi-arrayed substrate, a dicing section which dices the substrate with a cutting blade in accordance with information resulting from image recognition of the marks by the pre-alignment section, and an xy table which carries the substrate. The pre-alignment section recognizes in advance all marks on the substrate based on image recognition thereby to determine the dicing positions, and the dicing section merely recognizes a few points of the substrate with an alignment camera. Consequently, pre-alignment and dicing can take place concurrently, and the throughput of the dicing process can be improved.

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

Semiconductor device and a method of manufacturing the same

A machine tool precision-measuring apparatus comprising: a first linear movement distance-measuring means including a first slide shaft , a first slide bush slidably attached to the first slide shaft , and a first distance sensor for measuring a distance that the first slide shaft relatively travels with respect to the first slide bush ; and, a second linear movement distance-measuring means including a second slide shaft positioned across the first slide shaft , a second slide bush connected to the first slide bush , the second slide bush being slidably attached to the second slide shaft , and a second distance sensor for measuring a distance that the second slide shaft relatively moves with respect to the second slide bush . In use of this apparatus, a spindle of a machine tool to be measured is fixed to the first linear movement distance-measuring means , while the second linear movement distance-measuring means is fixedly positioned on a base , whereby trajectories of the spindle moving in directions of X- and Y-axes are measured. Such a construction provides a machine tool precision-measuring apparatus 10 having a simpler structure, lighter weight, and portability.

Machine tool precision-measuring apparatus

Semiconductor device an a method of manufacturing the same

Growing community of inventors

Iide, Japan

Yoshihiko Yamaguchi