Denki Kagaku Kogyo Kabushiki Kaisha

Denka Company Limited

Yoshihiko Tsujimura

Toru Arai

Hideki Hirotsuru

Akira Miyama

Yasuhito Fushii

Katsunori Yashima

Shinya Narita

Naomi Yonemura

Satoshi Higuma

Hidenori Ishikura

Takashi Saiki

Miyuki Nakamura

Katunori Yashima

[Problem] To provide a thermoplastic resin composition for use in an organ model, wherein said composition has a softness closer to that of an organ, a high mechanical strength, and a texture close to an organ, exhibits excellent durability, and can be handled easily. [Solution] A resin composition for an organ model, said composition containing, as component (A), 100 parts by mass of a hydrogenated block copolymer having an MFR (measured at a temperature of 230&#xb0; C. and a load of 2.16 kg) of 1 g/10 min. or less, and an oil as component (B). Moreover, the composition may also contain a cross copolymer as component (C), a polypropylene resin as component (D), and a filler as component (E).

Resin composition for organ models

A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C&#x2014;BN, silicon carbide, and alumina and have an average particle diameter of 10-100 &#x3bc;m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 &#x3bc;m, a thermal conductivity at 25&#xb0; C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150&#xb0; C. of 4&#xd7;10to 7.5&#xd7;10/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.3, and a three-point bending strength of 50-150 MPa.

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.

Metal-base circuit board and its manufacturing method

An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Substrate

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Tokyo, Japan

Yoshihiko Tsujimura