Nec Tokin Corporation

Nec Corporation

Kemet Electronics Corporation

Tokin Corporation

Airex Corporation

Yoshihiko Saiki

Satoshi Arai

Sadamu Toita

Takayuki Inoi

Toshihiko Nishiyama

Shinji Takeoka

Takashi Fukaumi

Kimihisa Yamamoto

Masahiko Takahashi

Kazumasa Ohya

Naoki Wako

Takashi Kono

Kenji Araki

Eishun Tsuchida

Koichiro Masuda

Tomitaro Hara

Hiromichi Taniguchi

Masashi Ohi

Atushi Kobayashi

Eiji Matsunaga

Kazuaki Fukushima

Takashi Mihara

Eishun Tuchida

Setsuo Noguchi

Kohtaroh Takahashi

A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.

Solid electrolytic capacitor

A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Solid electrolytic capacitor, transmission-line device, method of producing the same, and composite electronic component using the same

A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Printed circuit board and manufacturing method thereof

In an electronic circuit having an integrated circuit () having a power supply terminal, a noise filter disposed adjacent to the integrated circuit, and a printed board () having a pattern for supplying a power supply to the power supply terminals of the integrated circuit through the noise filter, the noise filter consists of a transmission line type noise filter () for removing noises having a wide frequency band.

Electronic circuit with transmission line type noise filter

An external cathode terminal () is adhered to one surface of a capacitor element while a prepreg () is adhered to another surface of the capacitor element. A reinforcement plate () is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (A,B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Thin surface mounted type solid electrolytic capacitor

A transmission line type noise filter, which is connectable between a direct current power supply and an electrical load component to pass a coming DC current while attenuating a coming AC current, includes a first conductor, a dielectric layer, a second conductor as a cathode, a first anode (), and a second anode. The first and the second conductors and the dielectric layer serve as a capacitance forming portion. The thickness of the first conductor is selected to substantially restrict temperature elevation of the first conductor, which is caused by DC direct current flowing in the first conductor.

Transmission line type noise filter with reduced heat generation even when large DC current flows therein

In a laminated solid electrolytic capacitor including a plurality of solid electrolytic capacitor elements, first end regions of anode bodies of the solid electrolytic capacitor elements adjacent to each other are mechanically connected to each other through a spacer. First end surfaces of the anode bodies of the solid electrolytic capacitor elements adjacent to each other are electrically connected to each other through an electrically conductive member.

Laminated solid electrolytic capacitor and laminated transmission line device increased in element laminating number without deterioration of elements

In a stacked solid electrolytic capacitor or a stacked transmission line element, anode portions of adjacent elements are electrically and mechanically connected to each other by the use of connecting members each in the form of a conductive adhesive or solderable metal, via metal plates connected to the anode portions so as to sandwich therebetween the anode portions, respectively, from the upper and lower surfaces thereof. On the other hand, cathode portions of the adjacent elements are electrically and mechanically connected to each other by a conductive adhesive, or are electrically and mechanically connected to each other by the use of adhesive insulating sheets each having a hollowed portion and a conductive adhesive filled in the hollowed portions, or are adhered to each other by adhesive insulating sheets, then electrically connected to each other by a conductive adhesive applied onto side surfaces of the cathode portions.

Stacked solid electrolytic capacitor and stacked transmission line element

A noise filter () has a first impedance element () having an impedance value Z, a second impedance element () having an impedance value Z, a third impedance element () having an impedance value Z, a first anode terminal (), a second anode terminal (), and a cathode terminal (). Z&#x3c;Zand Z&#x3c;Zare satisfied. Both ends of a central conductor () of the first impedance element () are connected to a first node () and a second node (), respectively. Both ends of the second impedance element () are connected to the first node () and the first anode terminal (), respectively. Both ends of the third impedance element () are connected to the second anode terminal () and the second node (), respectively. The central conductor () and a cathode conductor () of the first impedance element () form a transmission line structure having the impedance value Z. The cathode conductor () is connected to the cathode terminal ().

Transmission line type noise filter with small size and simple structure, having excellent noise removing characteristic over wide band including high frequency band

The invention provides a solid electrolytic capacitor of a configuration having a metal plated layer in a cathode part in order to prevent a decrease in the conductivity by oxidation of a conductive polymer and to realize a high reliability. Also there is provided a configuration in which a cathode part of the solid electrolytic capacitor includes a first metal plated layer and a solderable second metal layer.

A transmission line type noise filter includes a metal fine wire ( ) made of valve-operational metal and serving as a central conductor, a capacitance forming portion ( ) formed over a predetermined length on the periphery of the metal fine wire, and a conductor layer ( ) formed on the surface of the capacitance forming portion and serving as an external conductor. The capacitance forming portion ( ) includes a sintered body ( ) formed on the metal fine wire and made of the foregoing valve-operational metal, a dielectric film ( ) formed on the surface of the sintered body and serving as a dielectric, and a solid electrolyte layer ( ) formed on the surface of the dielectric film.

In an electronic device supplying a DC power to an LSI chip ( ), a noise filter ( ) of a distributed constant type, having an input port ( ) and an output port ( ), is mounted on a circuit board ( ). The noise filter ( ) reduces high-frequency noise incoming thereto and allows DC current to flow therethrough. The input port ( ) is connected to a DC power line ( ) and a ground conductor ( ) on the circuit board ( ). The output port ( ) is connected to a separate power conductor ( ) and a separate ground conductor ( ) which are connected to the LSI ( ) mounted on the circuit board ( ). In another embodiment, the LSI ( ) is mounted on a different circuit board ( ) to which the output port ( ) is connected through conductor pins ( ) standing on the circuit board ( ).

Electronic device for supplying DC power and having noise filter mounted with excellent noise reduction

An external cathode terminal ( ) is adhered to one surface of a capacitor element while a prepreg ( ) is adhered to another surface of the capacitor element. A reinforcement plate ( ) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material ( A, B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

A solid electrolytic capacitor has an anode terminal and a cathode terminal for external electrical connection that are formed on one surface of a plate-like or foil-like anode member, and a cathode conductor layer formed such that it covers the area of the one surface of the anode member except for the portion where the anode terminal is secured. A first metal plate or metal foil functioning as the cathode terminal is closely joined to the one surface of the cathode conductor layer so as to cover the one surface of the cathode conductor layer. A second metal plate or metal foil is closely joined to the other surface of the cathode conductor layer so as to cover the other main surface of the cathode conductor layer. The first metal plate or metal foil and the second metal plate or metal foil function to intercept the ventilation between the anode member and the outside.

Growing community of inventors

Sendai, Japan

Yoshihiko Saiki