Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Works, Ltd.

Panasonic Corporation

Ihi Infrastructure Systems Co., Ltd.

Yoshihiko Nakamura

Masahiro Matsumura

Mitsuyoshi Nishino

Daisuke Nii

Hidetsugu Motobe

Shunji Araki

Hiroyuki Fujisawa

Yukio Hatta

Kenichi Toshimitsu

Hiroharu Inoue

Tomoaki Sawada

Kiyotaka Komori

Yasushi Sawada

Tatsuya Arisawa

Hiroaki Umehara

Takayoshi Ozeki

Yasuo Fukuhara

Tomoyuki Abe

Hiroki Tamiya

Ryuji Takahashi

Narimasa Iwamoto

Kenji Ogasawara

Akihiro Yamauchi

Yoshiaki Esaki

Satoru Ogawa

Masaharu Yamamoto

Atsuomi Hirata

Hidetaka Kakiuchi

Koichi Isaji

Makizi Miyao

Kiyohiro Nagao

Takayuki Fukuda

Shigekazu Takanohashi

Hiroshi Toshima

Akihiro Atsumi

Kensaku Morii

Takashi Shinpo

Takuya Asano

Yuki Miyoshi

Fuminori Sato

Syouji Hasimoto

Satoshi Kawabata

Masashi Yabuno

Eiji Imaizumi

Kentarou Fujino

Takeshi Koizumi

Naoki Ito

Yuuji Tumuraya

Fuminori Satou

The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 &#x3bc;m to 30 &#x3bc;m. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.

Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg

A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.

Multilayer printed wiring board and method for producing multilayer printed wiring board

A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group. 

Metal foil with resin, and metal-clad laminate and circuit board using same

An epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass % as a percentage of the resin solids in the epoxy resin composition.

Epoxy resin composition, prepreg, resin-coated metal foil, resin sheet, laminate and multilayer board

A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

Resin composition, prepreg and laminate board

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m/g to 15 m/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

A plurality of movable temporary hangersare placed on a stay cableB hung in tension above a target stay cableC, and then the target stay cableC is held on a lower portion of the temporary hangers. Then, the target stay cableC held with the temporary hangeris detached from a bridge deckand a main tower. Then, the target stay cableC and the temporary hangersholding the target stay cableC are moved toward the bridge deckand removed.

Method for replacing sloped cables, and temporary hanger for replacing sloped cables

An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board

An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400&#xb0; C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board

An epoxy resin composition, which comprises, as an essential component, a phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having an average particle diameter of not greater than 30 &mgr;m, a bifunctional epoxy resin having an average of not less than 1.8 and less than 2.6 of epoxy groups in the molecule and a hardener, wherein the bifunctional epoxy resin is contained at an amount of not less than 51% by mass relative to the whole epoxy resin, at least one of dicyandiamide and a polyfunctional phenol system compound having an average of not less than 3 of phenolic hydroxy groups in the molecule is used as the hardener and a ratio (a/c) of equivalent (a) of a phenolic hydroxy group of the phosphorus compound and equivalent (c) of an epoxy group of the bifunctional epoxy resin is not less than 0.3 and less than 0.75, and wherein aluminium hydroxide is used as the inorganic filler, an amount of the inorganic filler to be added is not less than 15 parts by mass and less than 100 parts by mass relative to 100 parts by mass of the resin solids constituent, and the content of a phosphorus element is not less than 0.8% by mass and less than 3.5% by mass relative to the whole resin solids constituent.

Epoxy resin composition, prepreg and multilayer printed-wiring board

An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.

Prepreg of epoxy resin, hardener, and organodialkyurea promotor

In a process for manufacturing a prepreg for use as an electrically insulating material, a main epoxy resin composition and a subsidiary resin composition containing a hardener which have been separately filtered and metered are quickly mixed into a mixture resin composition, a reinforcing member is coated with a uniformly thin film of the mixture resin composition by a die coater under specific temperature, average residence time and low shear conditions, the coated reinforcing member is heated in non-contact manner by an infrared ray heater to have the member impregnated with the resin composition of the film, the member is further heated in non-contact manner by a floating dryer to have the resin composition semi-hardened, and the member is unified through compaction rolls, whereby the prepreg in the form of a sheet-shaped fiber reinforced composite material is continuously manufactured.

Process for manufacturing prepregs for use as electric insulating

A surface treatment of a glass fabric used for a fiber reinforced composite such as multilayer circuit boards comprises the steps of exposing the glass fabric to an atmospheric pressure plasma of a mixture gas to obtain a plasma-treated surface of the glass fabric, and coating an organosilane compound on the plasma-treated surface. The mixture gas contains as a reaction gas at least one of an oxidative gas and a fluorine-containing gas, and a rare gas as a carrier of the reaction gas. The mixture gas is pre-heated prior to the plasma excitation thereof. When the glass fabric includes an organic compound as a sizing agent, the organic compound can be efficiently removed from the glass fabric by the exposing step. For example, the organosilane compound can be coated on the plasma-treated surface by exposing the plasma-treated surface to a second atmospheric pressure plasma of a second mixture gas containing an organosilane monomer. The surface treatment of the present invention is useful to efficiently produce a multilayer circuit board having excellent adhesion between the glass fabric and a resin, and resistance to CAF (Conductive Anodic Filaments).

Process for a surface treatment of a glass fabric

An improved plastic molded chip carrier package for a semiconductor chip has a plurality of I/O pins arranged on a pin grid array. The pin grid array comprises at least two rows of the I/O pins disposed along the sides of the chip in such a manner that the I/O pins are staggered with respect to those in the other row. The staggered arrangement of the I/O pins makes it easy to provide electrical interconnection between the I/O ports on the chip and the corresponding I/O pins without requiring an elaborate or crowded wiring or connection lines. This is particularly effective when an increased number of the I/O pins are required to be included in the limited area of the chip carrier.

Plastic molded pin grid chip carrier package

Growing community of inventors

Fukushima, Japan

Yoshihiko Nakamura