Sony Corporation

Sony Semiconductor Solutions Corporation

Yoshihiko Nagahama

Tetsuji Yamaguchi

Takuji Matsumoto

Fumihiko Koga

Keiji Tatani

Yasushi Tateshita

Takashi Nagano

Keiichi Nakazawa

Naoyuki Miyashita

Takahiro Toyoshima

Atsushi Yamamoto

Kunihiko Hikichi

Kojiro Nagaoka

A first substrate having a plurality of photoelectric transducers formed on the first substrate, a second substrate having a pixel transistor for each of sets of two or more of the photoelectric transducers as a constituent unit, the pixel transistor being shared by the set and formed on the second substrate, and a second wiring which is connected to a first wiring formed on the second substrate via one contact, and is connected to a plurality of first elements, the first wiring leading to a second element shared by a plurality of first elements among a plurality of elements formed on the first substrate, each of the plurality of first elements being formed for each of the photoelectric transducers are included.

Image sensor and electronic apparatus

Provided is a semiconductor device including a plurality of substrates that is stacked, each of the substrates including a semiconductor substrate and a multi-layered wiring layer on the semiconductor substrate, the semiconductor substrate having a circuit with a predetermined function formed thereon. Bonding surfaces between at least two substrates among the plurality of substrates have an electrode junction structure in which electrodes on the respective bonding surfaces are in direct contact with each other. The electrode junction structure is for electrical connection between the two substrates. In at least one of the two substrates, at least one of the electrode constituting the electrode junction structure or a via for connection of the electrode to a wiring line in the multi-layered wiring layer has a structure in which a protective film for prevention of diffusion of an electrically-conductive material constituting the electrode and the via is inside the electrically-conductive material.

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

An imaging device includes a light shield that has light shielding walls and a plurality of light transmissive parts in a plurality of apertures between the light shielding walls and a light-receiving element layer in which a large number of light-receiving elements that perform photoelectric conversion corresponding to incident light inputted through the light transmissive parts of the light shield are arranged to acquire image information that has passed through optical elements that are different between the adjacent light transmissive parts. Further, the image information that passed through optical elements being different for every one of the light transmissive parts adjacent is acquired, and therefore, the sensor areas of the light receiving element is utilized effectively.

Imaging device utilizing sensor area of photoelectric conversion elements corresponding to incident light passed through optical elements including a layer of polarizers of horizontal and vertical directions and quarter wave plates

Disclosed is a solid-state imaging device which includes a pixel section, a peripheral circuit section, a first isolation region formed with a STI structure on a semiconductor substrate in the peripheral circuit section, and a second isolation region formed with the STI structure on the semiconductor substrate in the pixel section. The portion of the second isolation region buried into the semiconductor substrate is shallower than the portion buried into the semiconductor substrate of the first isolation region, and the height of the upper face of the second isolation region is equal to that of the first isolation region. A method of producing the solid-state imaging device and an electronic device provided with the solid-state imaging devices are also disclosed.

Solid-state imaging device, production method thereof, and electronic device

A solid-state imaging device which includes a pixel section, a peripheral circuit section, a first isolation region formed with a STI structure on a semiconductor substrate in the peripheral circuit section, and a second isolation region formed with the STI structure on the semiconductor substrate in the pixel section. The portion of the second isolation region buried into the semiconductor substrate is shallower than the portion buried into the semiconductor substrate of the first isolation region, and the height of the upper face of the second isolation region is equal to that of the first isolation region. A method of producing the solid-state imaging device and an electronic device provided with the solid-state imaging devices are also disclosed.

Disclosed herein is an insulated gate field effect transistor including: (A) a source/drain region and a channel formation region; (B) a gate electrode formed above the channel formation region; and (C) a gate insulating film; wherein the gate insulating film is composed of a gate insulating film main body portion formed between the gate electrode and the channel formation region, and a gate insulating film extension portion extending from the insulating film main body portion to a middle of a side surface portion of the gate electrode, and when a height of the gate electrode is Hand a height of the gate insulating film extension portion is Hwith a surface of the channel formation region as a reference, a relationship of H&#x3c;His fulfilled.

Insulated gate field effect transistor and a method of manufacturing the same

A semiconductor device including, on a substrate, a first conduction type MOS transistor having a gate electrode provided in a first trench formed in an insulation film on the substrate, and a second conduction type MOS transistor having a gate electrode provided in a second trench formed in the insulation film, the first conduction type and the second conduction type being opposite types.

Growing community of inventors

Kanagawa, Japan

Yoshihiko Nagahama