Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Yoshihiko Misawa

Kazuhiro Mori

Shigeru Araki

Makito Seno

Akira Kabeshita

Souhei Tanaka

Hiroshi Okamura

Toshio Yano

Kiyoshi Mayahara

Yasuo Taki

Taira Ishii

Ken Takahashi

Tomoyuki Nakano

Yoshinori Isobata

Takeshi Kuribayashi

Hideki Uchida

Kazuo Kido

Yoshinobu Maeda

Akira Iizuka

Hiroshi Nakagawa

Masuo Masui

Eigo Sarashina

Koichi Morita

Noriaki Yoshida

Hideaki Watanabe

Minoru Yamamoto

Takeyuki Kawase

Youichi Nakamura

Kazumasa Okumura

Naoto Mimura

Ken Takano

Kunio Sakurai

Keiji Saeki

Hidetoshi Kawa

Hirokazu Honkawa

Tetsutarou Hachimura

Toshiro Nishiwaki

Mitsuo Kawate

Kentaro Nishiwaki

Kenichi Sato

Eiji Itemadani

Nobuhisa Watanabe

Muneyoshi Fujiwara

Yoshiyuki Hattori

Satoshi Nonaka

Susumu Takaichi

Makoto Kawai

Koji Fujiwara

Setsuo Horimoto

Kazuo Watanabe

Tsutomu Inukai

Hitoshi Nakamura

Shigeru Araki, Deceased

Kengi Fukumoto

Toshiaki Sugimura

A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.

Component mounting apparatus, service providing device and servicing method

A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.

A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.

A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Component mounting apparatus and method

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimensionL+SL. Specifically,L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Components placing apparatus

A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Component mounter, service supplier, and service supplying method

A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device

Device and method for mounting parts

A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

Method of mounting a semiconductor chip on a wiring substrate

An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.

IC component mounting method and apparatus

A component mounting method, and an apparatus therefor, which includes the steps of causing a plurality of suction nozzles, supported for intermittent movement along a predetermined path in synchronism with each other, to receive electric components at a component receiving station and then to transport them towards a component mounting station, and effecting both the rectification of the position of each component in two directions perpendicular to each other and the angle adjustment of the respective component during the successive transportation of the components towards the component mounting station. Both the rectification of the position and the angle adjustment of each component are carried out while the associated suction nozzle is held still at a certain station, and electric characteristics of each component are checked during the rectification.

Method of and apparatus for mounting electric components

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Katano, Japan

Yoshihiko Misawa