Amkor Technology Singapore Holding Pte. Ltd.

Pioneer Plasma Display Corporation

Yoshihiko Ikemoto

Kenji Nishikawa

Yoshio Matsuda

Seiichiro Sato

A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Semiconductor devices with shield

A video display driver circuit adapted to receive and monitor an input video signal, which is associated with information or an image that is subsequently displayed on a display. The video display driver circuit includes circuitry for detecting movement of the information or image displayed on the display and circuitry for adjusting a vertical synchronization frequency associated with the display to enable the moving information or image to be smoothly reproduced in a number of locations on the display.

Growing community of inventors

Tokyo, Japan

Yoshihiko Ikemoto