Murata Manufacturing Co., Ltd.

Yoshihiko Goto

Yukio Yoshino

Tadashi Nomura

Masaki Takeuchi

Hajime Yamada

Masato Kobayashi

Yuzo Katayama

Kaoru Sudo

Hirotaka Fujii

Koichi Takizawa

A semiconductor component is face-up mounted on a package substrate. An antenna substrate is flip-chip mounted on a front side of the semiconductor component. A device-side high-frequency signal terminal is disposed on the front side of the semiconductor component, and an antenna-side high-frequency signal terminal is disposed on a back side of the antenna substrate. The device-side high-frequency signal terminal and the antenna-side high-frequency signal terminal are electrically connected to each other. Thus, the antenna substrate for high-frequency signals can be separated from the package substrate for baseband signals.

High-frequency module and communication apparatus

A piezoelectric resonator includes a substrate, a vibration unit disposed on the substrate and having a structure in which at least one pair of an upper electrode and a lower electrode opposed to each other, the upper and lower electrodes sandwiching the upper and lower surfaces of an internal thin-film portion including at least one layer of a piezoelectric thin-film, and an external thin-film portion provided under the lower electrode and including at least one layer of a piezoelectric thin-film or a dielectric thin-film, the vibration unit being vibrated in an n-th harmonic (n is an integer of 2 or more), the upper electrode and the lower electrode being provided substantially in the positions of the loops of the n-th harmonic.

Piezoelectric resonator, filter, and electronic communication device

A piezoelectric resonator includes a substrate and a plurality of vibrating portions constructed such that a thin film portion having a piezoelectric thin film of one or more layers is sandwiched by at least a pair of upper electrodes and a lower electrode, which are opposed to each other, on the upper and lower surfaces of the thin film portion. The vibrating portions are separated by at least a distance equal to about &lgr;/2, where &lgr; represents the vibration wavelength, from elements affecting the vibration characteristics.

Piezoelectric resonator, manufacturing method for the same, piezoelectric filter, manufacturing method for the same, duplexer, and electronic communication device

An inexpensive and reliable thin-film multilayered electrode which is formable on a dielectric substrate such as a ceramic substrate. A thin-film multilayered electrode has thin-film conductors and thin-film dielectrics formed by alternately layering on a dielectric substrate with a predetermined dielectric constant. The dielectric constant for each of the thin-film dielectrics is selected such that the electromagnetic field created in the dielectric substrate and the electromagnetic field created in each of the thin-film dielectrics are substantially in phase with each other when the thin-film multilayered electrode is used at a predetermined frequency, and the film thickness of each of the thin-film dielectrics falls between 0.2 .mu.m and 2 .mu.m; and the film thickness of each of the thin-film conductors, other than a thin-film conductor formed most distant from the dielectric substrate, is thinner than the skin depth at the predetermined frequency.

Thin-film multilayered electrode, high-frequency resonator, and

A thin-film multilayered electrode of a high frequency electromagnetic field coupled type is disclosed. The thin-film multilayered electrode comprises thin-film conductors and dielectric thin films alternately stacked on a dielectric substrate so that a plurality of TEM mode transmission lines are multilayered. A film thickness of each of the dielectric thin films is set so that phase velocities of TEM waves which propagate through at least two of the plurality of TEM mode transmission lines are made substantially equal to each other, and a film thickness of each of the thin-film conductors is set so as to be smaller than a skin depth of a frequency which is used so that electromagnetic fields of at least two of the plurality of TEM mode transmission lines are coupled with each other. The thin-film conductors include at least one adhesive layer having a large adhesion strength at one or more of interfaces between the dielectric substrate and the thin-film conductor and the interfaces between the thin film conductors and the dielectric thin films.

Growing community of inventors

Shiga-ken, Japan

Yoshihiko Goto