Taisei Corporation

Tokyo Electron Limited

Other

Tohoku University

Hitachi Cable, Inc.

Panasonic Corporation

Nichias Co., Ltd.

Kondoh Industries, Ltd.

Cambridge Filter Japan, Ltd.

Yoshihide Wakayama

Sadao Kobayashi

Masayuki Imafuku

Misako Saito

Hiroyuki Ito

Naoki Mori

Yasuyuki Shirai

Teruyuki Hayashi

Takenobu Matsuo

Kiyoshi Watanabe

Tsuyoshi Wakabayashi

Isao Terada

Hiromu Itoh

Naoya Hirayama

Tadahiro Ohmi

Kazuo Saito

Tsuneo Kimura

Takafumi Sakamoto

Koji Suzuki

Kazuki Moyama

Akinobu Teramoto

Kazutaka Uekado

Hitoshi Inaba

Osamu Suenaga

Seiichi Takizawa

Hideo Hanaoka

Yuji Matumura

Keiji Matsuno

Takashi Taniguchi

Toshihisa Okabe

Kikuji Kobayashi

Takeshi Yamada

Satoki Sugiyama

Minoru Tanaka

Disclosed is a solar cell comprising a solar cell semiconductor thin film formed on a base, a transparent conductive film formed on the semiconductor thin film, and a nitride-containing moisture diffusion-preventing film which covers the upper surface of the transparent conductive film. The moisture diffusion-preventing film is preferably composed of at least a silicon nitride film or a silicon carbide nitride (SiCN) film.

Solar cell wherein solar photovolatic thin film is directly formed on base

A heating device includes a heat resisting vacuum insulator () wound around the outer periphery of an electric heater () disposed along the outer wall of an exhaust pipe (), wherein the electric heater () has a resistance heating element and a heat resisting electric insulator covering this resistance heating element, and the heat resisting vacuum insulator () includes a hollow platy covering material air-tightly sealed thereinside by a metal seat () having a heat resisting temperature of at least 100&#xb0; C., and a fibrous or granular filling material () filled in the hollow portion of this covering material and having a heat resisting temperature of at least 100&#xb0; C., the inside of the covering material being kept in a vacuum state.

Heat resisting vacuum insulating material and heating device

An electric wire with coating of polyvinyl chloride family resin composition is disclosed which has a coating layer containing a polyvinyl chloride family resin composition comprising polyvinyl chloride family resin and one or more compounds selected from calcium soap, zinc soap and hydrotalcite. The polyvinyl chloride composition does not comprise either or both of a lead compound and a &#x3b2;-diketone compound having a melting point less than 100&#xb0; C. A plasticizer can be further added to the composition so as to obtain a heat-stable vinyl chloride composition. A cable covered with the polyvinyl chloride family resin composition is also disclosed, including a cable having electric wires coated with the polyvinyl chloride family resin composition.

Electric wire and cable with coating/covering of polyvinyl chloride family resin composition

A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

Method and device for cleaning air

A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like. Further, if the filter medium and the sealing material are formed of a material not releasing organic phosphorus compounds and boron compounds in the air, a clean room and a local facility particularly suitable for use in the production of semiconductors are provided.

Air filter, method of manufacturing air filter, local facility, clean room, treating agent, and method of manufacturing filter medium

The present invention has as its object to provide an air filter not only for trapping suspended particulate substances but also for not generating hazardous contaminates in the air, which cause trouble in the manufacture of semiconductor devices. As a binder to bind fibers of the air filter together, a polymer dispersion is used in which a copolymer of a hydrophilic monomer and a hydrophobic monomer is dispersed in water. As an initiator for polymerization of the copolymer, an organic peroxide is used. When an air filter () is installed downstream of a chemical filter (), the space () placed downstream of the air filter () is made substantially free of organic substances and/or inorganic substances that cause trouble in the manufacture of semiconductor devices.

Filter medium for air filter and process for producing the same

An electric wire with coating of polyvinyl chloride family resin composition is characterized by having a coating layer including polyvinyl chloride family composition obtained from adding more than one of any calcium soap, zinc soap and hydrotalcite to resin including polyvinyl chloride resin as a main constituent, and further adding thereto plasticizer so as to obtain a heat-stable vinyl chloride composition, and further adding thereto as stabilization auxiliaries high-melting-point &#x3b2;-diketone compound having a melting point more than 100&#xb0; C. out of &#x3b2;-diketone compounds expressed by a general formula of R.CO.CH2.CO.R'.

Electric wire coated with polyvinyl chloride resin composition and cable

An air cooling device includes at least one cooling unit which includes an oblique honeycomb having front, rear, upper, and lower openings and disposed so that air to be cooled is introduced into the front opening and cooled air is discharged from the rear opening, a cooling water supply means which supplies cooling water to the upper opening of the oblique honeycomb, and a water receiving section which receives discharge water discharged from the lower opening of the oblique honeycomb, and a blower means which introduces air to be cooled into the front opening of the oblique honeycomb and allows cooled air to be discharged from the rear opening of the oblique honeycomb, wherein the height of one oblique honeycomb in the cooling unit is 200 to 800 mm. The air cooling device has high thermal efficiency, a small liquid-gas ratio, and a small pressure drop, and is capable of saving space and energy.

Air cooling device and air cooling method

A room temperature curable organopolysiloxane composition of the ketone removal type comprising a diorganopolysiloxane having a minimized content of low-molecular-weight organopolysiloxanes as a base polymer, and an alkenoxysilane as a crosslinking agent does emit essentially no low-molecular-weight siloxanes and organic matter with the passage of time after curing and is suitable for use as a sealant in a clean room and as a sealant or adhesive on electrical and electronic parts.

Room temperature curable organopolysiloxane composition

Materials not releasing gaseous organic materials during use are used as a dry-type sealing material such as a gasket disposed upon mounting an air filter to an opening of a ceiling or the like, a wet-type sealing material filled and used in a gap for connecting wall materials or partitionings, a vinyl chloride sheet or a vinyl chloride cloth as a facing material for walls and floors. Specifically, a carboxylic acid ester having a molecular weight of not less than 400 is used as a plasticizer, a phenolic compound having a molecular weight of not less 300 is used as an antioxidant, an aliphatic hydrocarbon having not less than 19 carbon atoms (for example, microcrystalline wax) is used as a lubricant, and an alkylamine ethylene oxide adduct having a molecular weight of not less than 350 is used as an antistatic agent.

Wet sealing materials and building components useful for clean rooms and local facilities

Air filter

An electronic/electric part used in a clean room in which the atmosphere is controlled to process a substrate in a semiconductor device industry, which contains a resin base material and additives added to the resin base material. The additives contain one or more materials selected from the group consisting of an anti-electrostatic agent made of a nonionic compound of a molecular weight of 350 or higher, an anti-oxidizing agent made of a phenolic compound of a molecular weight of 300 or higher, a lubricant, a plasticizer, a fire retardant, and a water repellent. The additives hardly releases gaseous organic substances from the resin base material under a condition where the part is used.

Electronic/electric components used in clean room and substrate treatment apparatus

A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, in a semiconductor production apparatus or in the like. Further, if the filter medium and the sealing material are formed of a material not releasing organic phosphorus compounds and boron compounds in the air, a clean room and a local facility particularly suitable for use in the production of semiconductors are provided.

Air filter, local facility, and clean room

Building components useful for clean rooms

Air filter for clean room

Growing community of inventors

Tokyo, Japan

Yoshihide Wakayama