Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Yoshihide Oonari

Hirosaku Nagano

Hiroyuki Furutani

Hitoshi Nojiri

Yoshifumi Okamoto

Kazuhisa Danno

Junya Ida

The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular. The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Growing community of inventors

Otsu, Japan

Yoshihide Oonari