Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Yoshihide Ohnari

Kosuke Kataoka

Eiichiro Kuribayashi

Hitoshi Nojiri

Tsuneo Yamamoto

Junichi Hazama

Koji Okada

Eiichirou Kuribayashi

Masaro Kidoh

Katuhiro Kitai

Keigo Nishida

Toshinori Mizuguchi

A plastic film distinguished in corona resistant characteristic having a low cost without a low mechanical strength, which plastic film is particularly suitable for making insulated wires, coils, and electric motors capable of fully responding to demands for providing electric trains with higher running speeds and higher acceleration and deceleration. In accordance with one embodiment, the film includes a base layer and at least one thermally conductive layer having a minimum thermal conductivity of 2 W/m&middot;K, preferably 6 W/m&middot;K, more preferably 15 W/m&middot;K laminated horizontally on at least one surface of the base layer. In accordance with another embodiment, the film has a minimum volume electrical resistivity of 10,&OHgr;&middot;cm, preferably 10,&OHgr;&middot;cm, and includes a base layer and at least one low-electrical-resistance layer having a maximum superficial electrical resistance of 10,&OHgr;&middot;cm, preferably 10,&OHgr;&middot;CM. The thermally conductive layer is preferably formed from at least one inorganic compound or inorganic material selected from the group consisting of metal nitrides, metal carbides, metal silicides, and metal oxides.

Film distinguished in coriona resistant characteristic and insulated wires, coils and motors comprising the film as an insulation material

The present invention provides a reformed polyimide fluorocarbon resin laminated film having superior adhesive property with metals. The reformed polyimide fluorocarbon resin laminated film according to the present invention is constructed by that a surface of fluorocarbon resin of polyimide fluorocarbon resin laminated film having fluorocarbon resin being laminated on a single surface or both surfaces of a polyimide film is coated with a coupling agent, or executed with corona treatment.

Reformed polyimide fluorocarbon resin laminated film

The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.

Flexible copper-coated laminate and flexible printed circuit board

Polyimide resin film and method of making said film

The present invention provides a polyimide film whose residual content of volatiles is reduced to not more than 0.45 weight % on the basis of the film, and further a polyimide film whose residual content of volatiles is reduced to not more than 0.45 weight % on the basis of the film and whose oxygen/carbon ratio in the surface layer is increased by 0.01-0.1, and manufacturing methods therefor. According to the present invention, it is possible to provide a polyimide film improved in adhesion performance in a stable and homogeneous manner, and this improvement of adhesion performance is attainable in the film-forming process, not in a separate process of after-treatment.

Polyimide film and its manufacturing method

Growing community of inventors

Otsu, Japan

Yoshihide Ohnari