Seiko Epson Corporation

Yoshihide Nishiyama

Eiichi Sato

Noboru Sakurai

Shinji Mizuno

Yoshihiko Yokoyama

A discharge lamp includes a pair of electrodes for discharge and a discharge container having an inner space formed by quartz glass for separately placing the pair of electrodes and enclosing a discharge medium therein, a bulging part that surrounds the inner space, a pair of sealing parts that extend from ends of the bulging part and respectively support the pair of electrodes, an inner protective layer provided from a top portion opposed to a center of the pair of electrodes to a peripheral portion located at sides of the pair of sealing parts on an inner surface of the bulging part and having a thickness of the peripheral portion thinner than that of the top portion.

Discharge lamp, light source device and projector

A discharge lamp includes an arc tube and a boron oxide film formed on an inner surface of the arc tube.

Discharge lamp having a heat resistant film and method for producing same

A discharge lamp includes an arc tube made of quartz glass and enclosing a light emitting substance, and an electrode mainly made of tungsten and arranged in the arc tube, the electrode including at least one getter material that binds with oxygen.

Discharge lamp preventing devitrification, light source device, and projector

A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.

Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device

A semiconductor device includes: a connecting body including a connecting electrode; and at least one semiconductor chip stacked on the connecting body, the semiconductor chip including: a substrate; and a trans-substrate conductive plug that penetrates the substrate, the trans-substrate conductive plug having a first terminal that is provided on an active surface side of the substrate; and a second terminal that is provided on a back surface side that is opposite the active surface side, an outer shape of the first terminal being formed larger than an outer shape of the second terminal, wherein the second terminal of the semiconductor chip is electrically connected to a connecting electrode of the connecting body via a brazing material.

Method for manufacturing semiconductor device and semiconductor device

An apparatusA for manufacturing semiconductor devices includes a plurality of receiving portionsfor receiving an upper semiconductor packageon a top surface of the receiving portion. The receiving portion has a function of restricting the movement of the upper semiconductor packagein a direction parallel to a top surface of the upper semiconductor package. The receiving portionis a concave portion in which the upper semiconductor packageis adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor packageto the receiving portionmay be provided within the receiving portion, for example.

Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted. By using the apparatus, it becomes possible to provide a semiconductor device in which poor connections are difficult to occur, and further to provide an apparatus for manufacturing semiconductor devices and a method of manufacturing semiconductor devices that enable to prevent the occurrence of such poor connections in the obtained semiconductor devices and also enable to reduce manufacturing costs.

Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

A press-fit sealed electronic component includes an electronic component, a plug to be equipped with the electronic component, and a tube to be sealed by press-fitting the plug, wherein the plug is brought into close contact with the tube through a tin-free alloy layer. A method for producing a press-fit sealed electronic component includes the steps of forming the plug and the tube with a nickel silver material, forming a tin-copper layer by plating on each surface of the plug and the tube, forming a copper-zinc alloy layer at the interface between the nickel silver material and the tin-copper layer by heat treatment, removing the tin-copper layer remaining on the copper-zinc alloy layer to expose the copper-zinc alloy layer, and bringing the plug into close contact with the tube through the exposed copper-zinc alloy layer to seal the tube by press-fit.

Growing community of inventors

Chino, Japan

Yoshihide Nishiyama