Idemitsu Kosan Company, Limited

Adv Antest Corporation

Yoshihide Miyagawa

Haruo Yoshida

Yasuhiro Maeda

Manabu Tanaka

Toshiaki Yamaura

Akihiko Asano

Nobutaka Yoneyama

Mikio Hamano

A photoelectric conversion module () comprises a photoelectric conversion cell () and a grid electrode () provided in the photoelectric conversion cell () on a substrate. The photoelectric conversion cell () includes a first electrode layer (), a second electrode layer (), a photoelectric conversion layer () between the first electrode layer () and the second electrode layer (). The second electrode layer () is formed of a transparent electrode layer located on opposite side of the photoelectric conversion layer () to the substrate (). The grid electrode () is provided between the photoelectric conversion layer () and the transparent electrode layer.

Photoelectric conversion module and method for manufacturing photoelectric conversion module

The invention allows for testing by high velocity signals of high density LSIs prior to being packaged having an electrode spacing on the odder of 150 &mgr;m, for example. Coaxial transmission lines for termination formed through a terminal support are arranged in a two-dimensional array. Connected to one ends of the transmission lines are one ends of contact pins such as conductive whiskers while the other ends of the transmission lines are connected to a transmission line block of a three-dimensionally upwardly gradually broadening configuration through a connection plate similar in construction to the terminal support The transmission line block holds high frequency transmission lines for relay connected at one ends to the other ends of the coaxial transmission lines and having spacings between the adjacent lines broadened at the other upper ends. The widely spaced upper ends of the transmission lines are connected to a performance board (not shown). The contact pins are about 0.3 to 0.5 mm in length and the characteristics impedance is maintained uniform over all the transmission lines The terminal support is replaceable.

Integrated microcontact pin and method for manufacturing the same

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Tokyo, Japan

Yoshihide Miyagawa