Threebond Co., Ltd.

Yoshihide Arai

Takashi Nemoto

Kazuyuki Ueno

Kenichi Horie

Manabu Inoue

Yuko Nishiyama

Yoshiaki Koga

Hiroshi Kimura

Hiromasa Kitazawa

The present invention provides a photocurable composition containing an ultraviolet absorber, which yields a cured material thereof having a high cutting capability against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency, both immediately after preparing the same and after a lapse of time of being left in a severe environment such as a high-temperature and high-humidity environment, an environment exposed to water or light, and the like. The present invention relates to a sheet-shaped photocurable composition including the following components (A) to (E): a component (A): a (meth)acrylate compound; a component (B): a film forming resin; a component (C): a photoinitiator; a component (D): a compound having a specific skeleton structure; a component (E): a compound having a specific group in the molecule.

Photocurable composition and cured material thereof

The present invention provides a photocurable composition containing an ultraviolet absorber, which has high photocurability and yields a cured material having a high cutting capacity against ultraviolet rays from the outside, a low yellow index, and colorlessness and transparency. The present invention relates to a sheet-shaped photocurable composition which includes the following components (A) to (D), and when a cured material obtained after photocuring the photocurable composition has a thickness of 150 μm, a yellow index of the cured material is 4.0 or less and a light transmittance of the cured material at a wavelength of 385 nm is 5.0% or less: a component (A): a (meth)acrylate compound, a component (B): a film forming resin, a component (C): a photoinitiator, and a component (D): an ultraviolet absorber.

Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 &#x3bc;m or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

Photocurable composition

The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25&#xb0; C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25&#xb0; C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan &#x3b4;=1 is 30&#xb0; C. to 60&#xb0; C. before curing, a storage elastic modulus at 25&#xb0; C. is 10.0&#xd7;10Pa or less after curing. Component (A): urethane-modified (meth)acrylate oligomer Component (B): film forming agent Component (C): photoinitiator

It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90&#xb0; C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90&#xb0; C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application. A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.01% by mass to 45% by mass,

Sheet adhesive and adhesion process using the same

A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25&#xb0; C., but exhibiting fluidity in a temperature range of 50&#xb0; to 100&#xb0; C.

Photocurable resin composition for sealing organic EL device

An object of the present invention is to provide a damping and soundproofing member not only excellent in an excellent damping and soundproofing effect but also excellent in easiness of forming thereof, especially capable of forming directly a damping and soundproofing layer on a substance to be adhered and further excellent in lightness, washing ability, durability, and the like. The invention relates to a structure formed by laminating cured product layers formed from plurality of fluid resin compositions on a substrate expecting a damping or soundproofing effect, wherein at least two cured product layers of the above cured product layers are different in hardness. Moreover, preferably, no part of the hardest layer in the above cured product layers is directly formed on the substrate and the hardest layer is formed on the substrate via an intermediate layer.

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Tokyo, Japan

Yoshihide Arai